Buch, Englisch, 322 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 5772 g
Analog and Power Semiconductor Applications
Buch, Englisch, 322 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 5772 g
ISBN: 978-1-4939-5438-4
Verlag: Springer
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Chapter 1. Demand and Challenges for Wafer Level Analog and Power Packaging.- Chapter 2. Fan-In Analog Wafer Level Chip Scale Package.- Chapter 3. Fan-Out Analog Wafer Level Chip Scale Package.- Chapter 4. Wafer Level Analog Chip Scale Package Stackable Design.- Chapter 5. Wafer Level Discrete Power MOSFET Package Design.- Chapter 6. Wafer Level Packaging TSV/Stack die for Integration of Analog and Power Solution.- Chapter 7. Thermal Management, Design, Analysis for WLCSP.- Chapter 8. Electrical and Multi-Physics Simulations for Analog and Power WLCSP.- Chapter 9. WLCSP Typical Assembly Process.- Chapter 10. WLCSP Typical Reliability and Test.