Buch, Englisch, 600 Seiten, Format (B × H): 155 mm x 235 mm
Volume 3
Buch, Englisch, 600 Seiten, Format (B × H): 155 mm x 235 mm
Reihe: Lecture Notes in Electrical Engineering
ISBN: 978-3-032-36894-2
Verlag: Springer
The book presents latest innovations enabling ultrafast, energy-efficient, and reliable technologies across electronic and photonic domains. The book advances beyond the foundations of previous volumes by integrating developments in wide- and ultra-wide-bandgap semiconductors, two-dimensional materials, ferroelectrics, and spintronics with novel device architectures including HEMTs, nanosheet and fork sheet FETs, TFETs, NC-FETs, and in-memory computing systems. Circuit-level topics encompass nanosheet-based RF building blocks, photonic–electronic hybrids, fault-tolerant VLSI, and advanced interconnects. Emphasis is also placed on terahertz and photonic frontiers, highlighting high-capacity communication, imaging, and quantum technologies. Application-driven perspectives include MEMS–AI healthcare platforms, stress hormone and dopamine biosensors, photovoltaic forecasting, and wide-bandgap devices for electric vehicles and smart grids. With contributions from international experts, the volume addresses both fundamental principles and real-world applications, serving as a valuable reference for graduate students, researchers, and professionals seeking insights into the future of high-speed electronics and optoelectronics.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Introduction to Next-Generation High-Speed Electronics and Optoelectronics.- A Journey from Silicon Technology to Carbon Derivatives.- SiC Power Devices: From Fundamentals to Applications.- Terahertz, Millimeter-Wave, and Infrared Technologies: Design Issues and Challenges.- VLSI-Oriented Terahertz Measurement Systems: Techniques and Applications.




