Recent Advances in Manufacturing Engineering and Processes

Proceedings of ICMEP 2021
1. Auflage 2022
ISBN: 978-981-1639-33-3
Verlag: Springer Nature Singapore

Buch, Englisch, 201 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 335 g

Reihe: Lecture Notes in Mechanical Engineering

This book comprises select papers from the 10th International Conference on Manufacturing Engineering and Processes 2021. The contents of this volume focus on recent technological advances in the field of manufacturing engineering and processes including computer-aided design and manufacturing, environmentally sustainable manufacturing processes, composite materials manufacturing, and nanomaterials and nanomanufacturing. The contents cover latest advances especially in 3D printing and additive manufacturing techniques and processes for sustainable materials including ceramic and polymer-matrix composite where there is paucity of good papers in the literature. This book proves a valuable resource for those in academia and industry.

Zielgruppe

Research

Autoren/Hrsg.

Agarwal, Ramesh K.

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Verfahrenstechnik, Chemieingenieurwesen
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik

Inhaltsverzeichnis

Strongly Prime Radicals and S-primary Ideals in Posets.- Association Schemes over Some Finite Group Rings.- Rings whose nonunits are multiple of unit and strongly nilpotent element.- Improved Lower Bounds on Second Order Nonlinearities of Cubic Boolean Functions.- Ces`aro-Riesz Product Summability f - C1R; d q Factor for an Infinite Series

Über Autor(innen)

Prof. Ramesh K. Agarwal is William Palm Professor of Engineering, at Washington University in St. Louis, USA. Over a period of 45 years, Prof. Agarwal has worked in computational fluid dynamics (CFD), computational material science and manufacturing, and multi-disciplinary design and optimization. More recently, he has devoted some of his efforts in nanocomposites, shape memory alloys, and metamaterials. He is the author and co-author of over 600 publications and serves on the editorial board of more than 20 journals. Prof. Agarwal is a fellow of 25 societies including AIAA, IEEE, ASME, APS, IOM3, IET, RSC, etc.