Buch, Englisch, 178 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 440 g
Principles, Merits, Limitations, and Applications
Buch, Englisch, 178 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 440 g
ISBN: 978-0-367-27674-4
Verlag: CRC Press
Incremental Sheet Forming (ISF) exempts use of dies and reduces cost for manufacturing complex parts. Sheet metal forming is used for producing high-quality components in automotive, aerospace, and medical industries. This book covers the benefits of this new technology, including the process parameters along with various techniques.
Each variant of this novel process is discussed along with the requirements of machinery and hardware. In addition, appropriate guidelines are also suggested regarding the relationship between process parameters and aspects of ISF process in order to ensure the applicability of the process on the industrial scale.
This book will be a useful asset for researchers, engineers in manufacturing industries, and postgraduate level courses.
Zielgruppe
Professional
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau
- Naturwissenschaften Physik Mechanik
- Technische Wissenschaften Technik Allgemein Technik: Allgemeines
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Metallurgie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
- Technische Wissenschaften Technik Allgemein Industrial Engineering
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
Weitere Infos & Material
General Introduction and Need of Advanced Sheet Forming Techniques. Incremental Sheet Forming: A Die-less Approach. Incremental Sheet Forming Process. Machine Tools and Forming Tools for Incremental Sheet Forming Process. Incremental Sheet Forming Parameters. Responses of Incremental Sheet Forming Process. Applications and Challenges of Incremental Sheet Forming Processes. Conclusions and Future Scope.