Wafer Bonding

Applications and Technology
1. Auflage 2004
ISBN: 978-3-540-21049-8
Verlag: Springer

Buch, Englisch, Band 75, 504 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1035 g

Reihe: Springer Series in Materials Science

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Zielgruppe

Research

Autoren/Hrsg.

Alexe, Marin

Gösele, Ulrich

Fachgebiete

• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Naturwissenschaften Physik Thermodynamik Oberflächen- und Grenzflächenphysik, Dünne Schichten
• Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
• Technische Wissenschaften Technik Allgemein Physik, Chemie für Ingenieure
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
• Technische Wissenschaften Technik Allgemein Nanotechnologie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung

Inhaltsverzeichnis

1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding.- 2 Basics of Silicon-on-Insulator (SOI) Technology.- 3 Silicon-on-Insulator by the Smart CutTM Process.- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon.- 5 Wafer Bonding for High-Performance Logic Applications.- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices.- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach.- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits.- 11 Layer Transfer by Bonding and Laser Lift-Off.- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- 13 Wafer Bonding of Ferroelectric Materials.- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.