A guide to surface mount materials and processes
Buch, Englisch, 240 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1200 g
ISBN: 978-0-442-00727-0
Verlag: Springer US
Here is the first how-to handbook to cover the nuts and bolts of starting and running a successful SMT operation. This manual shows step by step how to set up and operate ny SMT procedure. It explains how to evaluate and refine SMT processes and keep them under control on a daily basis.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Foreword; Acknowledgments; Introduction; introduction to surface mount technology; Surface mount components nd component packaging; Surface mount printed circuit boards; Designing for assembly; soldering materials and related issues; Adhesive and solder paste application methods; Component placement; Reflow soldering and adhesive curing; Wave soldering; Cleaning; Rework; Manufacturing operations; Appendix