Reliability Prediction from Burn-In Data Fit to Reliability Models

Erscheinungsjahr 2014
ISBN: 978-0-12-800747-1
Verlag: Elsevier Science Publishing Co Inc

Buch, Englisch, 108 Seiten, Format (B × H): 151 mm x 228 mm, Gewicht: 172 g

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design.

Zielgruppe

Chip designers, electronic system designers and reliability engineers in electronics companies, chip manufacturers and microelectronics/ system designers

Autoren/Hrsg.

Bernstein, Joseph

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Schaltungsentwurf

Inhaltsverzeichnis

Introduction1. Shortcut to accurate reliability prediction2. M-HTOL Principles3. Failure Mechanisms4. New M-HTOL Approach5. Bibliography

Über Autor(innen)

Bernstein, Joseph
Joseph B. Bernstein is Professor of Electrical Engineering at Ariel University, Ariel, Israel. He received his PhD from MIT, Cambridge, MA, USA, and has previously worked as a Professor at Bar Ilan University, Israel, and at the University of Maryland and the MIT Lincoln Laboratory. He has co-authored two books.