Buch, Englisch, 358 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 581 g
Reihe: Microdevices
Buch, Englisch, 358 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 581 g
Reihe: Microdevices
ISBN: 978-1-4899-1806-2
Verlag: Springer
Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Naturwissenschaften Chemie Analytische Chemie Massenspektrometrie, Spektroskopie, Spektrochemie
Weitere Infos & Material
1. Transient Heating of Semiconductors by Radiation.- 2. Recrystallization of Implanted Layers and Impurity Behavior in Silicon Crystals.- 3. Crystallization, Impurity Diffusion, and Segregation in Polycrystalline Silicon.- 4. Component Evaporation, Defect Annealing, and Impurity Diffusion in the III–V Semiconductors.- 5. Diffusion Synthesis of Silicides in Thin-Film Metal—Silicon Structures.- 6. Rapid Thermal Oxidation and Nitridation.- 7. Rapid Thermal Chemical Vapor Deposition.- References.
