Plasma Processing for Semiconductor Materials and Thin-Film Devices

Erscheinungsjahr 2026
ISBN: 978-0-443-27741-2
Verlag: Elsevier Science

Buch, Englisch, 900 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 449 g

Plasma Processing for Semiconductor Materials and Thin-Film Devices covers the state-of-the-art in plasma processing of thin films. The book focuses on fundamental plasma theory, plasma for advanced applications, advanced characterization techniques, plasma and performance in semiconductor devices, and plasma processing. Sections consider the fundamental physics of plasma then move to advanced applications in the processing of semiconductor materials and their relation to the performance of semiconductor thin film devices. Subsequently, the book investigates the adoption of plasma for advanced (including thin film) characterization methods, finally addressing emerging plasma technologies such as liquid plasma, cold atmospheric plasma, and advanced plasma techniques.

This book will be of interest to students, researchers, and practitioners in any field that utilizes plasma processing, since its chapters have been written by leading authorities from both academia and industry.

Autoren/Hrsg.

Cheong, Kuan Yew

Akhavan, Behnam

Hsiao, Shih-Nan

Chen, Sheng-Chi

Le, Phuoc Huu

Fachgebiete

• Naturwissenschaften Chemie Analytische Chemie
• Naturwissenschaften Physik Physik Allgemein
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Verfahrenstechnik, Chemieingenieurwesen
• Naturwissenschaften Physik Elektromagnetismus Optik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde

Inhaltsverzeichnis

Section I: Background and introduction to plasma science
1. Plasma physics and applications
2. Plasma diagnostic theory and methods
3. Modelling of plasma chemistry

Section II: Plasma processing: Thin Film Deposition
4. Advanced physical vapor deposition (HiPIMS, etc)
5. Advanced chemical vapor deposition (PE-ALD, etc)
6. A review on plasma enhanced atomic layer deposition for advanced thin film deposition
7. Plasma Jet Deposition
8. Simulation of plasma model for metallic thin film deposition

Section III: Plasma processing: Surface modification of thin films
9. Surface functionalization of narrow bandgap semiconductors
10. Surface functionalization of Si, SiGe, and Ge semiconductors
11. Surface functionalization of wide bandgap semiconductors
12. Surface functionalization of ultra-wide bandgap semiconductors
13. Surface functionalization of advanced polymeric materials
14. Surface functionalization of metallic surface modification

Section IV: Thin film etching and other plasma-enabled processes
15. Low temperature plasma etching technology
16. Etching technology for narrow bandgap semiconductor
17. Etching technology for Si, SiGe, and Ge semiconductor
18. Etching technology for wide bandgap semiconductor
19. Etching technology for ultra-wide bandgap semiconductor
20. Advances of plasma atomic layer etching technology
21. Plasma dicing technology

Section V: Energy, sensor and environmental applications of liquid plasma processing
22. Synthesis of semiconductor nanomaterials for energy applications
23. Environmental sensors via liquid plasma processing
Section VI: Other advanced (thin film) plasma processing methods
24. Cold atmospheric plasma
25. Laser induced plasma
26. Plasma for 3D printing
27. Development of advanced plasma technology for semiconductor device thin film applications
28. Advances of plasma etching technology for 3D advanced packaging for high density memory devices

Section VII: Plasmas for advanced and thin film characterization techniques
29. Glow Discharge Mass Spectrometry (GD-MS)
30. Glow Discharge Optical Emission Spectroscopy (GD-OES)
31. Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
32. Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)

Section VIII: Plasma and performance of semiconductor thin film devices
33. Enhancement of device performance with plasma treatment
34. Plasma induced damages and material defects related to device performance
35. Plasma for wafer bonding

Über Autor(innen)

Le, Phuoc Huu
Phuoc Huu Le is an Associate Professor at the Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on the development and characterization of thin films, including thermoelectric materials, topological insulators, transparent conducting oxides, metal oxides, and half-Heusler compounds. He is also deeply engaged in the fabrication of nanomaterials through plasma-based and physical-chemical methods, with applications spanning photochemical water splitting, electrochemical sensors, and nanophotocatalysts for the degradation of emerging pollutants and contaminants.

Chen, Sheng-Chi
Sheng-Chi Chen is a Professor in the Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on nanotechnology applications, particularly in the fields of information storage, transparent conductive oxide and nitride films, as well as magnetic films. He specializes in plasma and thin-film processes and analyses of nanomaterial thin films deposited via sputtering, evaporation, and atomic layer deposition (ALD) processes.

Cheong, Kuan Yew
Kuan Yew Cheong is a Professor in the School of Materials and Mineral Resources Engineering at Universiti Sains Malaysia (USM). He specializes in semiconductor materials, electronic packaging, nanomaterials, and surface engineering, recognized as a top 2% researcher in applied physics/materials (2023). He has contributed to research on bio-organic-based memory to address e-waste.

Hsiao, Shih-Nan
Shih-Nan Hsiao is a Professor at the Center for Low-temperature Plasma Sciences, Nagoya University, Japan. His research interests include cryogenic plasma etching, atomic layer etching, plasma diagnostics, and simulations for semiconductor processes.

Akhavan, Behnam
Behnam Akhavan is an Associate Professor of Biomedical Engineering at the University of Newcastle, Australia, where he heads the Plasma Bio-engineering Research Group. His Lab develops new plasma science and surface engineering solutions for a range of modern applications, including plasma surface engineering of bone implants, cardiovascular devices, and artificial nerves; plasma polymer nanoparticles for drug delivery; electrochromic coatings for wearable electronics; and micro/nano particles for toxin removal and water purification.