De | Extreme Engineering Applications | Buch | 978-1-138-59543-9 | www.sack.de

Buch, Englisch, 500 Seiten, Format (B × H): 156 mm x 235 mm

De

Extreme Engineering Applications


1. Auflage 2021
ISBN: 978-1-138-59543-9
Verlag: Taylor & Francis Ltd

Buch, Englisch, 500 Seiten, Format (B × H): 156 mm x 235 mm

ISBN: 978-1-138-59543-9
Verlag: Taylor & Francis Ltd


Engineering designs are challenging during extreme operating conditions in terms of pressure and temperature. Recent innovations helped mankind reach regions, which were once inaccessible. Innovations in material, model, sensors and designs have helped mankind create robust and reliable wonders that work almost anywhere. This book pays tribute to such innovation and highlights the engineering development that made it possible. This book describes how engineering systems behave in various conditions by using examples ranging from oil and application to jet engines, and cryogenic cooling for space applications to plasma deposition. It also covers innovations and advancements in these fields.

De Extreme Engineering Applications jetzt bestellen!

Autoren/Hrsg.


Weitere Infos & Material


Introduction. High pressure engineering: Sub-sea application. High temperature engineering: Plasma coating. Low pressure engineering; Plasma reactor. Low temperature engineering: Cryo-cooling. High pressure & Low temperature engineering: super-critical CO2. High pressure & High temperature engineering: Jet engines. Low pressure & High temperature engineering: supersonic jet/space research. Low pressure & Low temperature engineering. Material challenges at extreme condition. Modelling challenge for extreme operating condition. Designing experiment for extreme condition.


Anindya Kanti De has worked in GE Global Research since 2008 where his research involved numerical modeling and experiments in flow-thermal phenomena. Prior to joing GE, he completed his Ph.D. from Virginia Tech. He has contributed to multiple journals and conference publications and filed numerous patents. He is also actively involved in HPC and GPGPU computation related activities while giving invited talks in various HPC forums and serving as chair for CFD related HP workshops.



Ihre Fragen, Wünsche oder Anmerkungen
Vorname*
Nachname*
Ihre E-Mail-Adresse*
Kundennr.
Ihre Nachricht*
Lediglich mit * gekennzeichnete Felder sind Pflichtfelder.
Wenn Sie die im Kontaktformular eingegebenen Daten durch Klick auf den nachfolgenden Button übersenden, erklären Sie sich damit einverstanden, dass wir Ihr Angaben für die Beantwortung Ihrer Anfrage verwenden. Selbstverständlich werden Ihre Daten vertraulich behandelt und nicht an Dritte weitergegeben. Sie können der Verwendung Ihrer Daten jederzeit widersprechen. Das Datenhandling bei Sack Fachmedien erklären wir Ihnen in unserer Datenschutzerklärung.