Advances in Mechatronics and Intelligent Systems

Proceedings of the 10th Asia International Symposium on Mechatronics (AISM 2025), Volume III
Erscheinungsjahr 2027
ISBN: 978-981-9250-53-0
Verlag: Springer Verlag, Singapore

Buch, Englisch, 578 Seiten, Format (B × H): 155 mm x 235 mm

Reihe: Lecture Notes in Electrical Engineering

The book presents high-quality papers from the Tenth Asia International Symposium on Mechatronics (AISM 2025). It showcases cutting-edge research and technological innovations in mechatronics, spanning electromechanical coupling, robotics, advanced manufacturing, and micro-nano systems. It bridges theoretical breakthroughs with industrial applications, offering practical insights for optimizing system design, enhancing automation efficiency, and addressing environmental adaptability challenges in electronic equipment. Contributions highlight interdisciplinary approaches to emerging trends like intelligent robotics and data-driven testing, equipping readers with novel methodologies to drive innovation in engineering. Case studies and experimental findings demonstrate real-world implementations, making it a valuable resource for both academic researchers seeking cross-disciplinary inspiration and industry professionals aiming to integrate state-of-the-art technologies into product development. The primary audience includes scholars, engineers, R&D specialists, and graduate students in mechatronics, mechanical engineering, electrical engineering, and related fields.

Zielgruppe

Research

Autoren/Hrsg.

Duan, Baoyan

Hu, Changming

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Regelungstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau

Inhaltsverzeichnis

Numerical prediction and analysis of cure-induced deformation in multi-angled composite parts for electromechanical structures.- Random Vibration Fatigue Analysis of Active Phased Array Antenna.- Improved Stochastic Amplitude-Phase Quantization Method for Comprehensive Electrical Performance Optimization of Array Antennas.- Experimental Study on Flow Characteristics of a Large-Scale Multi-Parallel System Based on Pump-Driven Two-Phase Cooling.- A Visual Detection Method for Wind Turbine Blade Defects Based on UAV-Captured Images.- Dynamics Characteristic Analysis and Pointing Accuracy Calculation of an Antenna.

Über Autor(innen)

Prof. Baoyan Duan, Academician of Chinese Academy of Engineering, IET Fellow, awardees of science and technology achievement award by Ho Leung Ho lee Foundation. He is the Chief Scientist of 973 project, Fellow of Electronic Institute of China, Chairman of Chinese Association of Electromechanical Engineering, and Chairman of Antenna Industry Association of China. So far he is the full professor of electromechanical engineering of Xidian University and the president of Xidian University during 2002-2012.

He has worked for both teaching and researching electromechanical engineering, focused on the coupling and integration between electronic and mechanical techniques. He pioneered a new field of electromagnetic-structural deformation-thermo coupling of electronic equipment in China. First, he developed a two-field-coupling model between electromagnetic and structural deformation of microwave reflector antennas. He proposed a systematic optimization method of homologous design of the reflector. Second, the integrated design theory and methodology of the servomechanism of radar and antenna are developed to solve the problem of mechanical factors affecting the pointing accuracy. An innovative design for a 500 meter diameter large telescope is proposed, initiating a new way in which a flexible structure composed of long cables is utilized to dynamically position the feed three-dimensionally. Third, the electromagnetic-structural deformation-thermo coupled model is presented for typical electronic equipment. The model reveals the relationship among the fields. The above key technology and program system have been successfully applied in many engineering projects, such as space shipping, surveys of deep space, and main warships.

As the first receiver, he has obtained the 2nd prize award of national science and technology three times and the 1st prize award of provincial level of science and technology three times. He has published 150 papers that are cited by SCI and EI and 5 books. The paper and book have been referenced 3600. He has made 23 patents of invention. Among his graduated Ph. D. students, one received the excellent Ph.D. dissertation of China, one received the Humboldt prize of Germany, and one received provincial outstanding contributions experts of Shaanxi Province.

Prof. Changming Hu is a member of the scientific and technology committee of the China education bureau, China industry and information bureau, and China general armament department.

Researcher at the 14th Research Institute of China Electronics Technology Group Corporation (CETC), Chief Expert of CETC and the 14th Research Institute, Executive Deputy Chairman of the Electromechanical Engineering Branch of the Chinese Institute of Electronics, Chairman of the National-level Industrial Design Center, Fellow of the Chinese Institute of Electronics, Member of the Intelligent Manufacturing Expert Committee of the National Manufacturing Power Construction Strategy Advisory Committee, and Member of the National Intelligent Manufacturing Standardization Expert Advisory Group. He has been engaged in research on complex electronic equipment structure technology and intelligent manufacturing technology for a long time and led the team to establish an integrated design and simulation platform for radar structure and technology, achieving full-process integration of design, technology, and manufacturing, with domestic leading technical standards.