Electronics Cooling: From the Chip to the Datacenter

Erscheinungsjahr 2026
ISBN: 978-0-443-47084-4
Verlag: Elsevier Science & Technology

Buch, Englisch, Format (B × H): 152 mm x 229 mm

Electronics Cooling: From the Chip to the Datacenter, Volume 62 provides a concise, practical guide that traces thermal management from the microchip to the data center. It explains how heat is generated at the transistor level, and how cooling strategies, conduction, convection, liquid immersion, and phase change cooling scale up to keep entire data centers reliable and energy-efficient. The book blends fundamentals (heat transfer, modeling, materials) with real-world design guidelines, case studies, and best practices for engineers, researchers, and students working on electronics cooling across all scales.

Autoren/Hrsg.

Weitere Mitwirkende

Abraham, John Patrick

Gorman, John M.

Vafai, Kambiz

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau
• Naturwissenschaften Physik Thermodynamik

Inhaltsverzeichnis

1. Passive Thermal Management of a Hard Disk Drive for Edge Appliances
Umesh Madanan, Shabeeh Kattakkadan, Nahoosh Mandlik and Niranjan Pol
2. TBD
Kambiz Vafai
3. TBD
Baghat Sammakia
4. TBD
Satish Kandlikar
5. TBD
Timothy S. Fisher
6. TBD
Ali Shakouri
7. TBD
Ahmet Mete Muslu
8. TBD
Ravi Mahajan and Rajiv Mongia
9. TBD
Wangda Zuo
10. Datacenters and cost analysis
Hyunjun Oh

Über Autor(innen)

Gorman, John M.
John Gorman is at University of Minnesota, Minneapolis, MN, USA

Abraham, John Patrick
John Abraham is at University of St. Thomas, Saint Paul, MN, USA

Vafai, Kambiz
Kambiz Vafai is a mechanical engineer, inventor, academic and author. He has taken on the roles of Distinguished Professor of Mechanical Engineering and the Director of Bourns College of Engineering Online Master-of-Science in Engineering Program at the University of California, Riverside. Vafai is most known for his pioneering work in phenomenological description, modeling and analysis for single and multiphase transport through porous media. His publications include journal articles and books such as Porous Media: Applications in Biological Systems and Biotechnology and the Handbook of Porous Media. Additionally, he is the recipient of the 75th Anniversary Medal of American Society of Mechanical Engineers (ASME) Heat Transfer Division in 2013, the 2006 ASME Memorial Award, and the 2011 International Society of Porous Media (InterPore) Honorary Lifetime Membership Award. Vafai is a Fellow of the American Society of Mechanical Engineers (ASME), the American Association for Advancement of Science (AAAS), the World Innovation Foundation, and Associate Fellow of American Institute of Aeronautics and Astronautics (AIAA). He has taken on the roles of Editor-in-Chief of the Journal of Porous Media and Special Topics and Reviews in Porous Media, Editor of International Journal of Heat and Mass Transfer and has held positions on the Editorial Advisory Board of the International Journal of Heat and Mass Transfer, International Communications in Heat and Mass Transfer, Numerical Heat Transfer Journal, International Journal of Numerical Methods for Heat and Fluid Flow, Experimental Heat Transfer Journal, and editorial board of the International Journal of Heat and Fluid Flow. Contact Reference 167207 Contact TypePersonCategoryNo Category AssignedDivisionsElsevier