Buch, Englisch, 210 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 371 g
ISBN: 978-1-4757-7373-6
Verlag: Springer US
addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.
Electrothermal Analysis of VLSI Systems jetzt bestellen!
Zielgruppe
Research
Fachgebiete
Weitere Infos & Material
The Building Blocks.- Power Analysis for CMOS Circuits.- Temperature-dependent MOS Device Modeling.- Thermal Simulation for VLSI Systems.- Fast-timing Electrothermal Simulation.- The Applications.- Temperature-dependent Electromigration Reliability.- Temperature-driven Cell Placement.- Temperature-driven Power and Timing Analysis.
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