Buch, Englisch, 1034 Seiten, Format (B × H): 178 mm x 254 mm
ISBN: 978-3-032-34111-2
Verlag: Springer
This book presents a comprehensive, academically rigorous, and industry-grounded framework for modeling power and performance in modern CPUs and GPUs. It bridges architectural theory, workload-driven performance analysis, and realistic chip-level power modeling, explicitly incorporating variations and constraints that are often treated as secondary or external—such as thermals, yield, reliability, and power delivery. By integrating these dimensions into a single framework, the book connects early architectural decisions to post-silicon behavior and manufacturing out-comes, and demonstrates how accurate power–performance (PnP) modeling can directly inform high-impact decisions including binning strategy, product stacking, and wafer utilization.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Microprocessor Topology Evolution.- Multi-Core Microprocessor Architecture.- Uncore Architecture.- Workload Classification and Characterization.- CPU/GPU Performance Modeling.- CPU/GPU Power Management.- Power Modeling Fundamentals.- Architecture Power Models.- Reliability Modeling.- SoC Thermal Modeling.- Die Yield Modeling.- Power Delivery Network Design.- Platform Design and Modeling.- SoC Power-Performance Conver-gence and Optimization.- Binsplit and Wafer Utilization Analysis.




