Buch, Englisch, 576 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 1019 g
Architecting for the Life Cycle
Buch, Englisch, 576 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 1019 g
ISBN: 978-0-19-508371-2
Verlag: Oxford University Press
This text integrates engineering principles with real applications from a systems perspective, providing a framework for developing electronic instrumentation, from hand-held devices to consoles. It offers practical design solutions, describes the interactions, trade-offs, and priorities encountered and then gives specific examples. Written as a principle text for a senior design class, it also serves as a reference handbook for practising engineers. While the focus is on projects often found in medium sized companies, many of the principles presented apply to larger companies as well.
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
- Preface
- Acknowledgments
- Abbreviations
- 1: Systems Engineering
- 1.1: Introduction
- 1.2: Overview of Systems Engineering
- 1.3: The Systems Perspective
- 1.4: Documentation
- 1.5: Concept Development
- 1.6: Requirements
- 1.7: Design Development
- 1.8: Rapid Prototyping and Field Testing
- 1.9: Validation, Verification, and Integration
- 1.10: Maintenance and Life-Cycle Costs
- 1.11: Failure, Iteration, and Judgment
- 1.12: Summary
- 1.13: Recommended Reading
- 1.14: References
- 2: Architecting and Engineering Judgment
- 2.1: Good Engineering
- 2.2: Questions to Ask
- 2.3: Architecting
- 2.4: Design Concerns and Heuristics
- 2.5: Teamwork and Trust
- 2.6: A Common Problem: Real-Time Control
- 2.7: Case Studies
- 2.8: Summary
- 2.9: Recommended Reading
- 2.10: References
- 3: Documentation
- 3.1: Don't Skip This Chapter
- 3.2: Types of Documentation
- 3.3: Records, Accountability, and Liability
- 3.4: Audience
- 3.5: Preparation, Presentation, and Preservation
- 3.6: Methods
- 3.7: Visual Techniques
- 3.8: Layout
- 3.9: Writing Well
- 3.10: Summary
- 3.11: Recommended Reading
- 3.12: References
- 4: The Human Interface
- 4.1: Man-Machine Dialgoue and Industrial Design
- 4.2: User-Centered Design
- 4.3: Five Elements of Successful Design
- 4.4: Cognition
- 4.5: Ergonomics
- 4.6: Utility
- 4.7: Principles for Appropriate Operation
- 4.8: Image
- 4.9: Ownership
- 4.10: Practical Applications and System Implications
- 4.11: Some Sources of Errors
- 4.12: Interface Design Specifications
- 4.13: Case Studies
- 4.14: Summary
- 4.15: Recommended Reading
- 4.16: References
- 5: Packaging and Enclosures
- 5.1: Packaging's Influence and Its Factors
- 5.2: Design for Manufacture, Assembly and Disassembly
- 5.3: Wiring
- 5.4: Temperature
- 5.5: Vibration and Shock
- 5.6: Rugged Systems
- 5.7: Component Packaging
- 5.8: Other Mechanical Issues
- 5.9: Case Studies
- 5.10: Summary
- 5.11: Recommended Reading
- 5.12: References
- 6: Grounding and Shielding
- 6.1: Foundations of Circuit Operation
- 6.2: Outline for Grounding and Shielding Design
- 6.3: Safety
- 6.4: Noise
- 6.5: Priniples of Energy Coupling
- 6.6: Grounding
- 6.7: Filtering
- 6.8: Shielding
- 6.9: Protecting Against Electrostatic Discharge
- 6.10: General Rules for Design
- 6.11: Case Study
- 6.12: Summary
- 6.13: Recommended Reading
- 6.14: References
- 7: Circuit Design
- 7.1: From Symbols to Substance
- 7.2: Convert Requirements into Design
- 7.3: Reliability
- 7.4: Fault Tolerance
- 7.5: High-Speed Design
- 7.6: Low-Power Design
- 7.7: Noise and Error Budgets
- 7.8: Standard Data Buses and Networks
- 7.9: Reset and Power Failure Detection
- 7.10: Interface: Input
- 7.11: Interface: Output
- 7.12: Breadboards, Evaluation Boards, and Prototypes
- 7.13: Summary
- 7.14: Recommended Reading
- 7.15: References
- 8: Circuit Layout
- 8.1: Mundane but Necessary Circuit Boards
- 8.2: Circuit Boards
- 8.3: Component Placement
- 8.4: Routing Signal Traces
- 8.5: Ground, Returns, and Shields
- 8.6: Connectors and Cables
- 8.7: Design for Manufacture
- 8.8: Testing and Maintenance
- 8.9: Summary
- 8.10: Recommended Reading
- 8.11: References
- 9: Power
- 9.1: Sources and Requirements
- 9.2: Outline for Power Design
- 9.3: Buy versus Build
- 9.4: Power Conversion Choices
- 9.5: Definitions and Specifications
- 9.6: Power Distribution
- 9.7: Line Conditioning
- 9.8: Electromagnetic Distribution
- 9.9: Reliability
- 9.10: Batteries
- 9.11: Other Power Sources
- 9.12: Case Studies
- 9.13: Summary
- 9.14: Recommended Reading
- 9.15: References
- 10: Cooling
- 10.1: Heat Transfer
- 10.2: Approach to Thermal Management
- 10.3: Mechanisms for Cooling
- 10.4: Operating Range
- 10.5: Basic Thermal Calculations
- 10.6: Cooling Choices
- 10.7: Heat Sink Selection
- 10.8: Heat Pipes and Thermal Pillows
- 10.9: Fans and Forced Air Cooling
- 10.10: Liquid Cooling
- 10.11: Evaporation and Refrigeration
- 10.12: Trade-offs in Design
- 10.13: Analysis and Experimentation
- 10.14: Case Studies
- 10.15: Summary
- 10.16: Recommended Reading
- 10.17: References
- 11: Software
- 11.1: Why Software in a Book about Exercises?
- 11.2: Types of Software
- 11.3: Traditional Software Life Cycle
- 11.4: Models, Metrics, and Software Limitations
- 11.5: Risk Abatement and Failure Prevention
- 11.6: Software Bugs and Testing
- 11.7: Good Programming Practice
- 11.8: User Interface
- 11.9: Embedded, Real-Time Software
- 11.10: Case-Studies and Design Examples
- 11.11: Summary
- 11.12: Recommended Reading
- 11.13: References
- 12: Debugging and Testing
- 12.1: Understand Your Components and Circuits
- 12.2: Steps to Debugging
- 12.3: Techniques for Troubleshooting
- 12.4: Characterization
- 12.5: Electromechanical Components
- 12.6: Passive Components
- 12.7: Active Devices
- 12.8: Operational Amplifiers
- 12.9: Analog-Digital Conversion
- 12.10: Digital Components
- 12.11: Case Study: Sensor Calibration
- 12.12: Summary
- 12.13: Recommended Reading
- 12.14: References
- 13: Integration, Production, and Logistics
- 13.1: Putting It All Together
- 13.2: Inspection and Tests of Components
- 13.3: Simulation, Protyping, and Testing
- 13.4: Integration
- 13.5: Validation and Verification
- 13.6: Procurement
- 13.7: Manufacturing
- 13.8: Maintenance and Repair
- 13.9: Training
- 13.10: Disposal and Environmental Concerns
- 13.11: Case Study: Test System for Avionics
- 13.12: Summary
- 13.13: References
- Appendix A: Outline of Milestones and Documents for Developing Electronic Instruments
- Appendix B: Design Review Checklists
- Appendic C: Software Design Tools
- Index
