THERMES 2007: Thermal Challenges in Next Generation Electronic Systems

Proceedings of THERMES 2007 conference, Santa Fe, New Mexico, January 7-10, 2007
Erscheinungsjahr 2007
ISBN: 978-90-5966-051-9
Verlag: Millpress

Buch, Englisch, 428 Seiten

With each new generation, electronic products have become faster and

have incorporated greater functionality. Coupling this trend with

shrinking device sizes leads to ever-increasing power densities. These

pressures highlight thermal management as a critical consideration at

all levels of the electronic product hierarchy from the chip to the

system.

Considering these critical design issues and the promises of new

technology, it is imperative for the thermal community to focus on these

thermal challenges to ensure the continued growth of the trillion-dollar

electronics industry.

THERMES 2007 provides a unique opportunity for the community to focus on

these challenges with a heavy emphasis placed on the many possible

solutions to these increased demands. This volume collects the many

promising ideas presented and covers a broad range of thermal

management topics from heat pipes and microchannel coolers to nanoscale

thermal transport, spanning harsh environments to microscale domains.

Autoren/Hrsg.

Garimella, S.V.

Fleischer, A.S.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien