Advances in Non-Destructive Evaluation

Select Proceedings of NDE 2024
Erscheinungsjahr 2027
ISBN: 978-981-9224-67-8
Verlag: Springer

Buch, Englisch, Format (B × H): 155 mm x 235 mm

Reihe: Lecture Notes in Mechanical Engineering

This book Advances in Non-Destructive Evaluation comprises the select peer-reviewed proceedings of the Conference and Exhibition on Non-destructive Evaluation (NDE 2024). It captures the forefront of innovation in ensuring the safety, reliability, and longevity of critical engineering systems. This volume brings together pioneering research and transformative technologies that are redefining the landscape of non-destructive evaluation (NDE).

From AI-powered pipeline diagnostics and intelligent thermographic imaging to advanced ultrasonic methods, terahertz techniques, and next-generation sensing systems, the contributions showcase how data-driven approaches are revolutionizing defect detection, structural health monitoring, and predictive maintenance.

Spanning key sectors such as energy, aerospace, nuclear, and civil infrastructure, this book highlights practical solutions to pressing industrial challenges—enhancing operational safety while reducing inspection costs and downtime.  The contents of this volume span a broad spectrum of non-destructive evaluation (NDE), from conventional ultrasonic, radiographic, and electromagnetic methods to emerging techniques such as terahertz imaging, microwave inspection, distributed sensing, and advanced thermography. The contributions further highlight the integration of artificial intelligence, machine learning, and advanced signal and image processing for enhanced defect detection, characterization, and real-time monitoring. Applications cover critical sectors including oil and gas, nuclear, aerospace, civil infrastructure, and advanced manufacturing, with a strong focus on structural health monitoring, reliability, quality assurance, and predictive maintenance. Bridging research and application, it offers powerful insights for advancing modern NDE practices.

This proceeding will be a essential reference for students, researchers, engineers, and industry professionals, and provides a compelling vision of the future of intelligent inspection and infrastructure integrity.

Zielgruppe

Research

Autoren/Hrsg.

Ghose, Bikash

Mulaveesala, Ravibabu

Mylavarapu, Phani

Fachgebiete

• Technische Wissenschaften Bauingenieurwesen Gebäudesicherheit
• Naturwissenschaften Physik Physik Allgemein Theoretische Physik, Mathematische Physik, Computerphysik
• Interdisziplinäres Wissenschaften Wissenschaften: Allgemeines

Inhaltsverzeichnis

Conventional, Advanced and emerging NDE techniques and technologies.- Materials Characterization by NDT.- NDE in Aerospace, Railways, Defence, Space, Automotive, Fabrication, Railways, Aeronautics, Civil and Structural Engineering, Nuclear, Petrochemical, Bio-Medical engineering etc.- Modeling and Simulation Signal and Image Processing.- NDE Sensors, Instrumentation, Software and Systems.- NDE 4.0 and Robotics, Automation.- Data Analytics, Artificial intelligence and machine learning in NDE.- Functional and Operational Testing, Reliability and Safety Assurance.- NDE in Corrosion Damage Monitoring.- Quality Control and Quality Assurance.- Pre and In-service Inspection.- Structural Health Monitoring and Ageing Management.- Structural Integrity Assessment and Life Extension.- Condition Monitoring and Residual Life assessment.- etc.

Über Autor(innen)

Dr Bikash Ghose is currently working as a Scientist in High Energy Materials Research Laboratory (HEMRL), Defence Research & Development Organisation (DRDO), Pune, India, and Group Director of the Imaging, Detection, Evaluation and Analysis group of HEMRL. He joined HEMRL after receiving M.Tech. from Indian Institute of Technology, Delhi, in 2002. He has over 21 years of experience in R&D in the area of non-destructive evaluation. His research interests include X-Ray radiography, high-energy X-ray LINAC radiography, digital radiography, computer radiography, 2D & 3D computerised tomography, ultrasonic guided wave, signal & image processing, computer vision, modelling & simulation, artificial intelligence & machine learning, automation and robotics. His research interest also includes explosive detection using RAMAN spectrometry & colorimetry techniques and also in the area of mechanical behaviour of materials and semiconductor device physics. He currently serves as Managing Editor and also as Member of the editorial board of Indian Journal of Non-destructive Testing & Evaluation. He is life member of Aeronautical Society of India (AeSI), High Energy Materials Society of India (HEMRL) and Indian Society for Non-Destructive Testing (ISNT). 

Prof. Ravibabu Mulaveesala received M.Tech. from National Institute of Technology (NIT), Tiruchirapalli, in 2000, and Ph.D. from Centre for Applied Research in Electronics, Indian Institute of Technology Delhi (IITD), India, in 2007. His research interests include thermal, acoustical and optical methods for non-invasive imaging/non-destructive testing technologies. He serves as an editorial or advisory boards of the several refereed journals of American Institute of Physics (AIP), Institute of Physics (IoP), Institute of Electrical and Electronics Engineers (IEEE), Institution of Engineering and Technology (IET), Elsevier, Taylor & Francis, Springer Nature, etc., and also to several peer-reviewed conferences.

Dr. M. Phani Surya Kiran received his Ph.D. degree from Louisiana State University, Baton Rouge, USA in 2007 with specialization on “non-destructive characterization of advanced composites used in aerospace and defence applications.” After couple of internship experiences at M/s Olson Engineering, Inc., Wheatridge, Colorado, USA working on "Applications of NDT in Concrete Industry", and M/s Intel Corporation, Chandler, Arizona working on "NDT applications for reliability in electronic industry", he has joined Defence Metallurgical Research Laboratory (DMRL), in the year 2010. He is currently working as Scientist “F” in the Non-Destructive Testing Group at DMRL.