Buch, Englisch, 504 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 785 g
Applications and Technology
Buch, Englisch, 504 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 785 g
Reihe: Springer Series in Materials Science
ISBN: 978-3-642-05915-5
Verlag: Springer
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Technik Allgemein Physik, Chemie für Ingenieure
- Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
- Technische Wissenschaften Technik Allgemein Nanotechnologie
- Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
- Naturwissenschaften Physik Thermodynamik Oberflächen- und Grenzflächenphysik, Dünne Schichten
- Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Oberflächenbeschichtung
Weitere Infos & Material
1 Direct Bonding, Fusion Bonding, Anodic Bonding, Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding.- 2 Basics of Silicon-on-Insulator (SOI) Technology.- 3 Silicon-on-Insulator by the Smart CutTM Process.- 4 ELTRAN® Technology Based on Wafer Bonding and Porous Silicon.- 5 Wafer Bonding for High-Performance Logic Applications.- 6 Application of Bonded Wafers to the Fabrication of Electronic Devices.- 7 Compound Semiconductor Heterostructures by Smart CutTM: SiC On Insulator, QUASICTM Substrates, InP and GaAs Heterostructures on Silicon.- 8 Three-Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach.- 9 Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers.- 10 High-Density Hybrid Integration of III–V Compound Optoelectronics with Silicon Integrated Circuits.- 11 Layer Transfer by Bonding and Laser Lift-Off.- 12 Single-Crystal Lithium Niobate Films by Crystal Ion Slicing.- 13 Wafer Bonding of Ferroelectric Materials.- 14 Debonding of Wafer-Bonded Interfaces for Handling and Transfer Applications.
