Liebe Besucherinnen und Besucher,
aufgrund unseres Sommerfestes sind wir am 03. September 2026 bis 14 Uhr erreichbar. Am 04. September 2026 sind wir wieder wie gewohnt für Sie da. Vielen Dank für Ihr Verständnis.
Ihr Team von Sack Fachmedien
Buch, Englisch, 763 Seiten, Format (B × H): 165 mm x 234 mm, Gewicht: 1134 g
Reihe: MRS Conference Proceedings
Buch, Englisch, 763 Seiten, Format (B × H): 165 mm x 234 mm, Gewicht: 1134 g
Reihe: MRS Conference Proceedings
ISBN: 978-1-55899-539-0
Verlag: Materials Research Society
The revolution in materials and processes for IC metallization presents exciting challenges for the future. This book, the 16th in a popular series from MRS, provides a forum within the IC metallization community, across industrial, academic and government institutions, for presentation and discussion of leading-edge research, development and technology. In particular, the volume focuses on Cu and low-k dielectrics spanning materials, properties, processing, integration and reliability. Two keynote addresses are featured - one on 'The MARCO/DARPA Interconnect Focus Cente' a cooperative research program involving several top universities in the U.S. whose mission it is to explore new interconnect strategies for the future, the other on 'Low-Cost and High-Performance DRAM Technology'. Additional topics include: integration of damascene architectures; copper-deposition processes and properties; barriers for copper; low-k dielectrics; aluminum, tungsten and DRAM metallization; silicides; CMP/cleaning/etching; process modeling and reliability.
