System-in-Package

Electrical and Layout Perspectives
1. Auflage 2011
ISBN: 978-1-60198-458-6
Verlag: Now Publishers

Buch, Englisch, Band 13, 96 Seiten, Format (B × H): 156 mm x 234 mm

Reihe: Foundations and Trends® in Electronic Design Automation

With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system. System-in-Package: Electrical and Layout Perspectives focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as IO (input/output cell) placement and routing for redistribution layer, escape, and substrate. System-in-Package: Electrical and Layout Perspectives is an invaluable reference for EDA researchers, professionals and graduate students.

Autoren/Hrsg.

He, Lei

Elassaad, Shauki

Shi, Yiyu

Hu, Yu

Yao, Wei

Fachgebiete

• Mathematik | Informatik EDV | Informatik Technische Informatik Eingebettete Systeme
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren

Inhaltsverzeichnis

1: Introduction 2: IC Package Tutorial 3: System-in-Package Design Exploration 4: Placement and Routing for SiP. References