Electrical Conductive Adhesives with Nanotechnologies

2010
ISBN: 978-1-4899-8307-7
Verlag: Springer

Buch, Englisch, 437 Seiten, Previously published in hardcover, Format (B × H): 155 mm x 235 mm, Gewicht: 680 g

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Zielgruppe

Research

Autoren/Hrsg.

Li, Yi (Grace)

Lu, Daniel

Wong, C.P.

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Technik Allgemein Nanotechnologie

Inhaltsverzeichnis

Nanotechnology.- Characterizations of Electrically Conductive Adhesives.- Isotropically Conductive Adhesives (ICAs).- Anisotropically Conductive Adhesives/Films (ACA/ACF).- Non-Conductive Adhesives/Films (NCA/NCF).- Conductive Nano-Inks.- Intrinsically Conducting Polymers (ICPs).- Future Trend of Conductive Adhesive Technology.