LIA Handbook of Laser Materials Processing

1. Auflage 2001
ISBN: 978-3-540-41770-5
Verlag: Springer

Buch, Englisch, 715 Seiten, Format (B × H): 215 mm x 286 mm, Gewicht: 2041 g

Published by the Laser Institute of America, The LIA Handbook of Laser Materials Processing is a working reference source designed to help solve problems by providing extensive data on procedures, processes, equipment, processing systems and processing results.
The basic information about the various laser materials processing technologies presented here can help you determine:
- Their potential effectiveness for your application.
- Their capabilities and limitations.
- Their requirements.
- The numerical values for the laser parameters.
- The numerical values for the processing results (i.e., penetration depth and processing rates for specified conditions of irradiation).

Zielgruppe

Research

Autoren/Hrsg.

Weitere Mitwirkende

Farson, D.F.

Ready, John F.

Feeley, T.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Naturwissenschaften Physik Elektromagnetismus Quantenoptik, Nichtlineare Optik, Laserphysik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Werkzeugbau
• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Technische Wissenschaften Sonstige Technologien | Angewandte Technik Lasertechnologie, Holographie

Inhaltsverzeichnis

Overview of Laser Materials Processing Lasers for Materials Processing.- Optics and Optical Systems.- Components for Laser Materials Processing Systems.- Laser -Material Interactions.- Hazards and Safety Considerations.- Surface Treatment: Heat Treatment.- Surface Treatment: Glazing, Remelting, Alloying, Cladding and Cleaning.- Brazing/Soldering.- Conduction Welding.- Penetration Welding.- Laser Cutting.- Hole Drilling.- Balancing.- Marking.- Rapid Prototytping.- Rapid Prototytping.- Trimming.- Laser Marking/Branding.- Link Cutting/Marking.- Repair.- Applications in Photolithography.- Flat Panel Display.- High-Temperature Superconductors (HTSC).- Laser Produced Microstructures.- Electronic Packaging: Electronic Interconnects.- Electronic Packaging: Package Sealing and Ceramic.- Processing.- Film Deposition and Doping.