Buch, Englisch, 204 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 341 g
Interconnects, Devices and Systems
Buch, Englisch, 204 Seiten, Paperback, Format (B × H): 155 mm x 235 mm, Gewicht: 341 g
ISBN: 978-1-4899-8211-7
Verlag: Springer
The book also includes exercises and detailed solutions at the end of each chapter.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
Weitere Infos & Material
Introduction to Reliability and its Importance.- Reliability Metrology.- General Failure Mechanisms of Microsystems.- Solder and Conductive Adhesive Joint Reliability.- Accelerated Testing.- Reliability Design for Manufacturability.- Component Reliability.- System Level Reliability.- Reliability and Quality Management of Microsystem.- Experimental Tools for Reliability Analysis.