High-Frequency Characterization of Electronic Packaging

Erscheinungsjahr 2014
ISBN: 978-1-4613-7573-9
Verlag: Springer

Buch, Englisch, 158 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 277 g

Reihe: Electronic Packaging and Interconnects

will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.

Zielgruppe

Research

Autoren/Hrsg.

Martens, Luc

Fachgebiete

• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Regelungstechnik
• Technische Wissenschaften Energietechnik | Elektrotechnik Elektrotechnik

Inhaltsverzeichnis

1: Electronic Packaging and High Frequencies.- 1.1 Packaging and high-frequency effects.- 1.2 Overview of the book chapters.- References.- 2: Electrical Description of Electronic Packaging.- 2.1 Introduction.- 2.2 Circuit descriptions.- 2.3 Qualitative characteristics.- 2.4 Conclusions.- References.- 3: High-Frequency Measurement Techniques.- 3.1 Introduction.- 3.2 Frequency-domain instruments.- 3.3 Time-domain network analyzer.- 3.4 Comparison of frequency- and time-domain network analyzers.- 3.5 Error correction.- 3.6 Conclusion.- References Appendix 3.A: Spatial resolution of the TDR/T-technique.- 4: High-Frequency Measurement Techniques for Electronic Packaging.- 4.1 Introduction.- 4.2 General test fixtures.- 4.3 Dedicated test fixtures with coaxial-planar transitions.- 4.4 On-board probing.- 4.5 Comparison of the coaxial-planar and coplanar probe transitions.- 4.6 De-embedding.- 4.7 Measuring 2N-port structures with two-port instruments.- 4.8 Conclusion.- References.- 5: Measurement-Based Modeling Algorithms.- 5.1 Introduction.- 5.2 One-port components.- 5.3 Transmission lines.- 5.4 General interconnections and packaging.- 5.5 Conclusions.- References.