Particles on Surfaces 2

Detection, Adhesion, and Removal
1989. Auflage 1990
ISBN: 978-0-306-43367-2
Verlag: Springer

Buch, Englisch, 336 Seiten, Gewicht: 780 g

This volume documents the proceedings of the Second Symposium on Particles on Surfaces: Detection, Adhesion and Removal held as part of the 19th Annual Meeting of the Fine Particle Society in Santa Clara, California, July 20-25, 1988. The premier symposium on this topic was l organized in 1986 and has been properly chronicled. Based on the success of these two events and the high interest evinced by the technical community, we plan to regularly hold symposia on this topic on a biennial basis and the next one is slated for August 20-24, 1990 in San Diego, California. l As pointed out in the Preface to the first volume, the topic of particles on surfaces is of paramount importance in legion of technological areas. Particularly in the semiconductor device fabrication area, all signals indicate that the understanding of the behavior of particles on surfaces and their removal will attain heightened importance in the times to come. As the device dimensions are shrinking at an accelerated pace, so the benign particles of today will become the killer defects in the not too distant future. The tempo of research and development activity in the field of particles on surfaces is very high, and better and novel ways are continuously being devised to remove smaller and smaller particles.

Zielgruppe

Research

Autoren/Hrsg.

Mittal, K L

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Technologie der Kunststoffe und Polymere
• Naturwissenschaften Chemie Anorganische Chemie Nichtmetallische Chemie
• Naturwissenschaften Chemie Organische Chemie Polymerchemie
• Naturwissenschaften Chemie Physikalische Chemie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffkunde, Materialwissenschaft: Forschungsmethoden
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Polymerwerkstoffe
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Werkstoffprüfung

Inhaltsverzeichnis

I. Particle-Substrate Interaction, Deposition and Adhesion.- The Adhesion of Small Particles to a Surface.- Application of Impact Adhesion Theory to Particle Kinetic Energy Loss Measurements.- Adhesion Force Due to a Meniscus in a Crossed-Fiber System.- Adhesion Induced Deformations Between Particles and Substrates.- The Effect of External Noises on the Attachment of Particles to Solid Surfaces.- Measurement of Detachable Submicrometer Particles and Surface Cleanliness of Clean Room Garments.- Accumulation of Particle Derived Ionic Contaminants on Electronic Equipment: Airbone Concentrations and Deposition Velocities.- Adhesion of Ash Particles on Heat Transfer Surfaces in Coal Combustion Applications: Mechanisms and Implications.- Factors Affecting Adhesion of Drug Particles to Surfaces in Pharmaceutical Systems.- II. Particle Detection, Analysis and Characterization.- The Role of Infrared and Raman Microspectroscopies in the Characterization of Particles on Surfaces.- Infrared and Raman Microspectroscopy: An Overview of Their Use in the Identification of Microscopic Particulates.- Particle Identification by Auger Electron Spectroscopy.- Identification and Characterization of Normetallic Particulate Contamination Removed from Aerospace Components.- Surface Particle Inspection Plans in Semiconductor Manufacturing.- Particulate Generation and Detection on Surfaces.- Identification of Small Particles on a Silicon Wafer.- The Evaluation of PWA and SMA Cleanliness Levels for “In-Line” Defluxing by High Performance Liquid Chromatography.- III. Particle Prevention and Implications.- Wear Resistant Coatings Reduce Particulate Contamination in a Magnetic Disk Drive.- Particle Reduction on Silicon Wafers as a Result of Isopropyl Alcohol Vapor Displacement Drying after WetProcessing.- Implications of Particle Contamination for Thin Film Growth.- Implications of Particulate Contamination in E-Beam Lithography.- IV. Particle Removal.- Enhanced Removal of Sub-Micron Particles from Surfaces by High Molecular Weight Fluorocarbon Surfactant Solutions.- Comparison of Freon with Water Cleaning Processes for Disk-Drive Parts.- Ultrasonic and Hydrodynamic Techniques for Particle Removal from Silicon Wafers.- New Sonic Cleaning Technology for Particle Removal from Semiconductor Surfaces.- About the Contributors.