Buch, Englisch, Band 6, 568 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1042 g
Technologies and Applications
Buch, Englisch, Band 6, 568 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 1042 g
Reihe: Springer Series in Advanced Microelectronics
ISBN: 978-3-540-43238-8
Verlag: Springer Berlin Heidelberg
This book provides a survey of the state of the art of technology and future trends in the new family of Smart Power ICs and describes design and applications in a variety of fields ranging from automotive to telecommunications, reliability evaluation and qualification procedures. The book is a valuable source of information and reference for both power IC design specialists and to all those concerned with applications, the development of digital circuits and with system architecture.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Halb- und Supraleitertechnologie
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
- Naturwissenschaften Physik Elektromagnetismus Halbleiter- und Supraleiterphysik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
Weitere Infos & Material
1 BCD Technologies for Smart Power ICs.- 2 Technologies for High Voltage ICs.- 3 Smart Discrete Technologies.- 4 Dielectric Isolation Technologies and Power ICs.- 5 Power Mosfets Driving Circuits and Protection Techniques.- 6 Motion Control.- 7 Switching Regulators.- 8 High Voltage Integrated Circuits for Off-Line Power Applications.- 9 Automotive Electronics.- 10 Audio Amplifiers.- 11 High Complexity Smart Power Devices and Future Developments.- 12 Modeling, Design and Simulation of Power Electronic Devices and Circuits.- 13 Packaging.- 14 Reliability of Smart Power ICs.
