Next Generation Microchannel Heat Exchangers

2013
ISBN: 978-1-4614-0778-2
Verlag: Springer

Buch, Englisch, 116 Seiten, Format (B × H): 155 mm x 235 mm, Gewicht: 2058 g

Reihe: SpringerBriefs in Applied Sciences and Technology

In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature.  Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.

Zielgruppe

Research

Autoren/Hrsg.

Ohadi, Michael

Cetegen, Edvin

Choo, Kyosung

Dessiatoun, Serguei

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Technische Thermodynamik

Inhaltsverzeichnis

Fundamentals of Microchannels.- Next Generation Force-Fed Microchannels Heat Exchanger (FFMHX).-  Emerging Applications of Microchannels.

Über Autor(innen)

Dr. Michael Ohadi is Professor of Mechanical Engineering and Co-Director of the Center for Environmental Energy Engineering at the University of Maryland, College Park; Dr. Kyosung Choo is a Research Associate in the Smart & Small Thermal Systems Laboratory in the mechanical engineering department at the University of Maryland, College Park; Dr. Serguei Dessiatoun is Research Associate Professor in Mechanical Engineering at the University of Maryland, College Park; Dr. Edvin Cetegen is a Research Scientist at Intel Corp.