Soldering Processes and Equipment

1. Auflage 1993
ISBN: 978-0-471-59167-2
Verlag: Wiley

Buch, Englisch, 312 Seiten, Format (B × H): 161 mm x 240 mm, Gewicht: 642 g

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Autoren/Hrsg.

Pecht, Michael G

Inhaltsverzeichnis

Solders, Solder Fluxes, and Solder Pastes.

Wave Soldering.

Reflow Soldering.

Cleaning and Contamination.

Reliability and Quality.

Rework, Repair, and Manual Assembly.

Appendix.

Glossary of Soldering Terms.

Index.

Über Autor(innen)

Michael Pecht is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.