Lcp for Microwave Packages and Modules

Erscheinungsjahr 2012
ISBN: 978-1-107-00378-1
Verlag: Cambridge University Press

Buch, Englisch, 266 Seiten, Format (B × H): 179 mm x 254 mm, Gewicht: 674 g

Reihe: The Cambridge RF and Microwave Engineering Series

A comprehensive overview of electrical design using Liquid Crystal Polymer (LCP), giving you everything you need to know to get up-to-speed on the subject. This text describes successful design and development techniques for high-performance microwave and millimeter-wave packages and modules in an organic platform. These were specifically developed to make the most of LCP's inert, hermetic, low-cost, high-frequency (DC to 110+ GHz) properties. First-hand accounts show you how to avoid various pitfalls during design and development. You'll get extensive electrical design details in areas of broadband circuit design for low-loss interconnects, couplers, splitters/combiners, baluns, phase shifters, time-delay units (TDU), power amplifier (PA) modules, receiver modules, phased-array antennas, flexible electronics, surface mounted packages, Microelectromechanical Systems (MEMS) and reliability. Ideal for engineers in the fields of RF, microwave, signal integrity, advanced packaging, material science, optical and biomedical engineering.

Autoren/Hrsg.

Pham, Anh-Vu H.

Chen, Morgan J.

Aihara, Kunia

Fachgebiete

• Technische Wissenschaften Technik Allgemein Technische Optik, Lasertechnologie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Mechatronik, Mikrosysteme (MEMS), Nanosysteme
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikrowellentechnik

Inhaltsverzeichnis

1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability.

Über Autor(innen)

Aihara, Kunia
Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.

Chen, Morgan J.
Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Pham, Anh-Vu H.
Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010–2012.

Anh-Vu H. Pham is a Professor at the University of California, Davis, where he leads the Microwave Microsystems Lab. He has published around 100 peer-reviewed papers, several book chapters and one book, is currently the Vice Chair of IEEE International Microwave Symposium Technical Committee on Power Amplifiers and Integrated Devices and a Microwave Distinguished Lecturer of the IEEE MTT for the term 2010-2012.

Morgan J. Chen is a Staff Engineer at FutureWei Technologies, an R&D US subsidiary of Huawei Technologies. He has worked in both academia and industry for over a decade, advancing high-frequency packaging from DC to past 60 GHz.

Kunia Aihara is an Electronics Engineer in the RF/EO Subsystems branch of the Air Force Research Laboratory.