Liebe Besucherinnen und Besucher,
aufgrund unseres Sommerfestes sind wir am 03. September 2026 bis 14 Uhr erreichbar. Am 04. September 2026 sind wir wieder wie gewohnt für Sie da. Vielen Dank für Ihr Verständnis.
Ihr Team von Sack Fachmedien
Buch, Englisch, Format (B × H): 155 mm x 235 mm
Materials, Modeling, and Circuit Integration
Buch, Englisch, Format (B × H): 155 mm x 235 mm
Reihe: Lecture Notes in Nanoscale Science and Technology
ISBN: 978-3-032-37850-7
Verlag: Springer
This book offers a comprehensive exploration of the design and technology of nanoscale semiconductor devices, with a special focus on novel materials and structures that address the limitations of conventional silicon-based technologies. As the miniaturization of devices pushes beyond traditional scaling limits, alternative materials—such as 2D materials, Germanium, III-V compounds, carbon, and graphene—are critical to overcoming challenges like short channel effects, high leakage currents, and power dissipation.
Targeted towards researchers, scientists, and postgraduate students, this book covers cutting-edge device architectures such as FinFETs, GAA-FETs, nanowires, CNTFETs, TFETs, FeFETs, HEMTs, and spin-based devices. It also details the modeling, simulation, and application-driven design for low-power, high-performance VLSI systems.
With clear explanations and in-depth analysis, this volume bridges the gap between traditional MOSFET fabrication and next-generation nanoelectronic design. Readers will gain a solid understanding of material properties, device behavior, and circuit co-design strategies, making it an essential resource for advancing chip design in the sub-micron era.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Technik Allgemein Nanotechnologie
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien
- Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde Materialwissenschaft: Elektronik, Optik
Weitere Infos & Material
Novel Devices with Carbon and Graphene Architectures Materials and Applications.- MLGNR Interconnects for Deep Submicron VLSI A Performance Perspective.- Recent Deposition Technologies and Emerging Thin Film Materials for Next Generation Nanoscale Microelectronics.- Functions and Properties of Nanoscale Semiconductors.- A Scoping Review on TFET Based mmWave Circuits and Antenna Integration for 6G Opportunities and Challenges.- Low Power SRAM Design Techniques for Energy Efficient Memory System.- Memristive Chemical Sensors Physics Modelling and Direct Digitisation.- Transformative Advances in Electromagnetic Absorber Modeling A Chronological and Technological Insight.- Device Level Optimization of InSe FETs Role of Asymmetric Underlap and High k Dielectrics in Analog RF Applications.- Recent Advances in Spintronics based Neurons for Neuromorphic Computing Device Principles and Applications.- 2D Materials for Nanoscale Semiconductor Devices.




