Materials and Processes for Next Generation Lithography

Erscheinungsjahr 2016
ISBN: 978-0-08-100354-1
Verlag: Elsevier Science & Technology

Buch, Englisch, 634 Seiten, Format (B × H): 193 mm x 242 mm, Gewicht: 1470 g

As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography.

These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches.

This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication.

Zielgruppe

<p>Lithographers, chemists and device fabricators from the Semiconductor industry, microelectromechanical systems industry, and from device and micro/nanotechnology research in academia. </p>

Autoren/Hrsg.

Robinson, Alex

Weitere Mitwirkende

Robinson, Alex

Lawson, Richard

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Chemische Verfahrenstechnik
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik

Inhaltsverzeichnis

1. Overview of materials and processes for lithography 2. Molecular excitation and relaxation of extreme ultraviolet lithography photoresists 3. Theory: Electron-induced chemistry 4. EUV lithography process challenges 5. EUV lithography patterning challenges 6. The chemistry and application of nonchemically amplified (non-CA) chain-scission resists 7. Chemically amplified resists and acid amplifiers 8. Negative-tone organic molecular resists 9. Positive molecular resists 10. Mainstreaming inorganic metal-oxide resists for high-resolution lithography 11. Molecular organometallic resists for EUV (MORE) 12. SML electron beam resist: Ultra-high aspect ratio nanolithography 13. Alternative resist approaches 14. Next generation lithography-the rise of unconventional methods? 15. Tip-based nanolithography methods and materials 16. Thermal scanning probe lithography 17. Scanning helium ion beam lithography

Über Autor(innen)

Robinson, Alex
Dr Robinson obtained his PhD in 1999 for work on the development of materials for electron beam lithography performed at the Nanoscale Physics Research Laboratory of the University of Birmingham, and the Joint Research Center for Atom Technology in Japan. Following his PhD he investigated the modification of oxide surfaces using self-assembled monolayer, before returning to the Nanoscale Physics Research Laboratory to continue his research in lithography and microfabrication. He has recently taken up a Senior Research Fellowship in the Science City Research Alliance, based in the School of Chemical Engineering and the School of Chemistry at the Universities of Birmingham and Warwick respectively. He is currently investigating the application of advanced materials within the field of microfabrication, and the integration of functional materials with patterned substrates.

Lawson, Richard
Dr Lawson received his B.S. in Chemical Engineering at Tennessee Technological University in 2005. He received a Ph.D. in Chemical & Biomolecular Engineering in 2011 at the Georgia Institute of Technology where he also completed a Postdoctoral Fellowship. Since 2015, he has been at Milliken & Company where he is a Research Engineer working in the area of chemical technologies. He is an author of over 22 publications, 41 conference proceedings, and a U.S. Patent in the area of patterning materials including photoresist and block copolymer design, synthesis, and characterization along with simulation of resist processing and BCP self-assembly.