Buch, Englisch, 176 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 265 g
Reihe: MRS Proceedings
Volume 613
Buch, Englisch, 176 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 265 g
Reihe: MRS Proceedings
ISBN: 978-1-107-41314-6
Verlag: Cambridge University Press
Chemical-mechanical polishing (CMP) is a critical technology in the planarization of multilevel metallization systems and shallow-trench isolation in semiconductor manufacturing. Other emerging applications for this technology include flat-panel displays, magnetic data storage and microelectromechanical systems. The rapid emergence of copper as the conducting material for integrated circuits has further pushed CMP technology to the forefront of semiconductor manufacturing. However, a basic understanding of the CMP process, which is necessary to enable further advances, is inadequate. This book, first published in 2001, provides an insight into the fundamental processes in CMP. Presentations from academia, government institutions and industry are featured. Topics include: CMP mechanisms; dielectric and metal CMP; process integration and manufacturability; and CMP consumables.
