Buch, Englisch, Band 77, 1154 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 2107 g
Proceedings of the 2019 International Conference on Mechanical Design (2019 ICMD)
Buch, Englisch, Band 77, 1154 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 2107 g
Reihe: Mechanisms and Machine Science
ISBN: 978-981-329-940-5
Verlag: Springer Nature Singapore
Focusing on innovation, these proceedings present recent advances in the field of mechanical design in China and offer researchers, scholars and scientists an international platform for presenting their research findings and exchanging ideas. Gathering outstanding papers from the 2019 International Conference on Mechanical Design (2019 ICMD) and the 20th Mechanical Design Annual Conference, the content is divided into six major sections: industrial design, reliability design, green design, intelligent design, bionic design and innovative design. Readers will learn about the latest trends, cutting-edge findings and hot topics in the field of design.
Zielgruppe
Research
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Technik Allgemein Konstruktionslehre und -technik
- Technische Wissenschaften Technik Allgemein Mess- und Automatisierungstechnik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik
- Technische Wissenschaften Maschinenbau | Werkstoffkunde Maschinenbau Konstruktionslehre, Bauelemente, CAD
Weitere Infos & Material
Design Methodology.- Industrial Design.- Sustainable Design/Green Design.- Intelligent Design.- Biomimetic Design.- Design Tools/Platform and applications.- Internet Plus Mechanical Design.-Mechanism and Machine Composition Principle.- Kinematics and Dynamics.- Experimental Method in Mechanisms.- Robotics and Mechanics.- Design of Micro/nano Mechanisms and Machines.- Design of Machine Tools.- Design of Construction Machinery.- Vehicle Mechanisms and Dynamic Design.- Mechanical Structure and System Dynamics.- Engineering Tribology and Tribological Design.- Reliability Design.- Education in Mechanisms and Machine Science.