Insights into Semiconductor Technologies

Transistor, Interconnect, Packaging, Lithography and Memory
Erscheinungsjahr 2026
ISBN: 978-3-032-03999-6
Verlag: Springer

Buch, Englisch, 216 Seiten, Format (B × H): 173 mm x 246 mm, Gewicht: 610 g

Reihe: Synthesis Lectures on Engineering, Science, and Technology

This book explores the technological advancements in semiconductors through several key aspects: transistor, interconnect, lithography, packaging, and memory. By blending together the history and technological progress with interesting stories, and avoiding complex physics or formulas, the book aims to spark the interest of a diverse group of readers, encouraging them to enter this exciting industry. Additionally, it seeks to broaden the horizons of engineers who are currently focused on narrow areas of the field, offering them a more comprehensive perspective on the industry's vast scope and potential.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Tu, Yuan

Fachgebiete

• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
• Mathematik | Informatik EDV | Informatik Technische Informatik Eingebettete Systeme

Inhaltsverzeichnis

Moore’s Law.- Transistor.- Interconnect.- Packaging.- Lithography.- Memory.- Perspective.

Über Autor(innen)

Yuan Tu obtained his bachelor's degree from Wuhan University in China, and holds a Ph.D. degree from Tohoku University in Japan. Afterwards he pursued his postdoctoral research at Chinese Academy of Sciences, and subsequently the Interuniversity Microelectronics Centre (IMEC) in Belgium. His expertise is semiconductor materials and devices characterization with advanced microscopic techniques, including electron microscopy, scanning probe microscopy and atom probe tomography.  He co-founded AtomSolve, a platform dedicated to materials and devices analysis, with the aim of advancing research and development in emerging materials and devices.