Sonstiges, Englisch, 730 Seiten, Format (B × H): 124 mm x 140 mm, Gewicht: 56 g
Reihe: ETG-Fachbericht
13th International Conference on Integrated Power Electronics Systems, March, 12 – 14, 2024, Düsseldorf, Germany
Sonstiges, Englisch, 730 Seiten, Format (B × H): 124 mm x 140 mm, Gewicht: 56 g
Reihe: ETG-Fachbericht
ISBN: 978-3-8007-6288-0
Verlag: VDE Verlag
In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).
CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems´ and components‘ operational behaviour and reliability
