Buch, Englisch, 392 Seiten, Format (B × H): 170 mm x 244 mm, Gewicht: 675 g
Buch, Englisch, 392 Seiten, Format (B × H): 170 mm x 244 mm, Gewicht: 675 g
ISBN: 978-0-521-78500-6
Verlag: Cambridge University Press
This book covers the experimental and theoretical understanding of surface and thin film processes. It presents a unique description of surface processes in adsorption and crystal growth, including bonding in metals and semiconductors. Emphasis is placed on the strong link between science and technology in the description of, and research for, new devices based on thin film and surface science. Practical experimental design, sample preparation and analytical techniques are covered, including detailed discussions of Auger electron spectroscopy and microscopy. Thermodynamic and kinetic models of structure are emphasised throughout. The book provides extensive leads into practical and research literature, as well as resources on the World Wide Web (see http://venables.asu.edu/book). Each chapter contains problems which aim to develop awareness of the subject and the methods used. Aimed as a graduate textbook, this book will also be useful as a sourcebook for graduate students, researchers and practitioners in physics, chemistry, materials science and engineering.
Autoren/Hrsg.
Fachgebiete
- Naturwissenschaften Chemie Anorganische Chemie Festkörperchemie
- Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
- Naturwissenschaften Physik Thermodynamik Oberflächen- und Grenzflächenphysik, Dünne Schichten
- Naturwissenschaften Physik Thermodynamik Physik der Zustandsübergänge
Weitere Infos & Material
Preface; 1. Introduction to surface processes; 2. Surfaces in vacuum: ultra-high vacuum techniques and processes; 3. Electron-based techniques for examining surface and thin film processes; 4. Surface processes in adsorption; 5. Surface processes in epitaxial growth; 6. Electronic structure and emission processes at metallic surfaces; 7. Semiconductor surfaces and interfaces; 8. Surface processes in thin film devices; 9. Postscript: where do we go from here?; Appendices; References.
