Buch, Englisch, 113 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 364 g
Reihe: IFIP Advances in Information and Communication Technology
Architecting the Future: Intelligent Systems for Embedded AI, Autonomous Technologies, and Digital Twins
Erscheinungsjahr 2025
ISBN: 978-3-032-07101-9
Verlag: Springer
8th IFIP TC 10 International Embedded Systems Symposium, IESS 2024, Gainesville, FL, USA, October 14-15, 2024, Proceedings
Buch, Englisch, 113 Seiten, Format (B × H): 160 mm x 241 mm, Gewicht: 364 g
Reihe: IFIP Advances in Information and Communication Technology
ISBN: 978-3-032-07101-9
Verlag: Springer
This book constitutes the refereed proceedings of the 8th IFIP TC 10 International Embedded Systems Symposium, IESS 2024, held in Gainesville, FL, USA, during October 14–15, 2024.
The 9 full papers included in this volume were carefully reviewed and selected from 10 submissions. They were organized in the following topical sections: Architectures and Integration for Intelligent Embedded Systems; Hardware-Aware Deep Learning for Edge and Mobile Platforms; Digital Twins and Smart Environments for Autonomous and Urban Systems.
Zielgruppe
Research




