Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Effects of temperature, moisture and mechanical driving forces
Erscheinungsjahr 2015
ISBN: 978-1-84569-528-6
Verlag: Woodhead Publishing

Buch, Englisch, 200 Seiten, Format (B × H): 152 mm x 229 mm, Gewicht: 830 g

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.

The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.

The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.

Autoren/Hrsg.

Wong, E-H

Mai, Y.-W.

Fachgebiete

• Technische Wissenschaften Maschinenbau | Werkstoffkunde Produktionstechnik Fertigungstechnik
• Technische Wissenschaften Technik Allgemein Technische Zuverlässigkeit, Sicherheitstechnik
• Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Elektronische Baugruppen, Elektronische Materialien

Inhaltsverzeichnis

Temperature induced failureMoisture induced failureMechanical shock induced failureAdhesive interconnects and viscoelasticityConcluding remarksPrograms and macro filesTemperature induced failureMoisture induced failureMechanical induced failure

Über Autor(innen)

Mai, Y.-W.
Dr Yiu-Wing Mai is Chair and Professor of Mechanical Engineering at the University of Sydney, Australia