Baklanov / Ho / Zschech Advanced Interconnects for ULSI Technology

1. Auflage 2012
ISBN: 978-1-119-96324-0
Verlag: John Wiley & Sons
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 624 Seiten, E-Book

Finding new materials for copper/low-k interconnects is critical tothe continuing development of computer chips. While copper/low-kinterconnects have served well, allowing for the creation of UltraLarge Scale Integration (ULSI) devices which combine over a billiontransistors onto a single chip, the increased resistance andRC-delay at the smaller scale has become a significant factoraffecting chip performance.
Advanced Interconnects for ULSI Technology is dedicatedto the materials and methods which might be suitable replacements.It covers a broad range of topics, from physical principles todesign, fabrication, characterization, and application of newmaterials for nano-interconnects, and discusses:
* Interconnect functions, characterisations, electricalproperties and wiring requirements
* Low-k materials: fundamentals, advances and mechanical properties
* Conductive layers and barriers
* Integration and reliability including mechanical reliability,electromigration and electrical breakdown
* New approaches including 3D, optical, wireless interchip, andcarbon-based interconnects
Intended for postgraduate students and researchers, in academiaand industry, this book provides a critical overview of theenabling technology at the heart of the future development ofcomputer chips.

Autoren/Hrsg.

Baklanov, Mikhail

Ho, Paul S.

Zschech, Ehrenfried

Über Autor(innen)

Mikhail R. Baklanov
IMEC, Leuven, Belgium
Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA
Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany