Balasinski Design for Manufacturability

From 1D to 4D for 90–22 nm Technology Nodes
1. Auflage 2013
ISBN: 978-1-4614-1761-3
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 278 Seiten

Reihe: Engineering

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes.  It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package.

Zielgruppe

Professional/practitioner

Autoren/Hrsg.

Balasinski, Artur

Inhaltsverzeichnis

Preface.- Classic DfM: from 2D to 3D.- DfM at 28 nm and Beyond.- New DfM Domain: Stress Effects.- Conclusions and Future Work.

Über Autor(innen)

Artur Balasinski is a Technology Design Integration Manager for Cypress Semiconductor in San Jose, California.