E-Book, Englisch, 696 Seiten, E-Book
Bosse / Lehmhus / Lang Material-Integrated Intelligent Systems
1. Auflage 2017
ISBN: 978-3-527-67926-3
Verlag: Wiley-VCH
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
Technology and Applications
E-Book, Englisch, 696 Seiten, E-Book
ISBN: 978-3-527-67926-3
Verlag: Wiley-VCH
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)
Ein Referenzwerk von Autoren aus Wissenschaft und Forschung mit engen Verbindungen zur Industrie vereint Aspekte der Material- und Computerwissenschaften und des Engineering zu einem einheitlichen Blick auf vielversprechende Ansätze für materialintegrierte intelligente Systeme.
Autoren/Hrsg.
Weitere Infos & Material
SENSOR AND ELECTRONICS DEVELOPMENT FOR MATERIAL INTEGRATION
Function Scale Integration - The Concept of Limiting Wounds to Materials Induced by Sensor Integration
Development of New Types of Sensors Specifically Addressing Host Material Integration Aspects
Compliant Sensor and Electronics Technology
Techniques for Integrating Sensors with Materials: Bulk and Surface Integration
INTERFACING TECHNOLOGIES
Electrical and Optical Connectivity
Bonding Techniques
Printing Techniques for Interfacing Structures
RELIABLE DATA PROCESSING PROVIDING ROBUSTNESS
AI Methods for Data Evaluation
Networking with Distributed Data Processing
Sensor Signal Processing: Sensor Data Fusion
RELIABLE COMMUNICATION PROVIDING ROBUSTNESS
Communication Protocols on Link and Application Layer: Hard- and Software Side
Communication on Physical Layer: Hardware Side, Physical Realization
ENERGY SUPPLY
Distribution, Management, Harvesting and Storage of Energy
Low-Power Electronics for Signal and Data Processing
APPLICATIONS
Smart Skin
Structural Health Monitoring
Body Area Networks
Smart Textiles
Casttronics
Metacomposites Programming
SENSOR AND ELECTRONICS DEVELOPMENT FOR MATERIAL INTEGRATION
Function Scale Integration - The Concept of Limiting Wounds to Materials Induced by Sensor Integration
Development of New Types of Sensors Specifically Addressing Host Material Integration Aspects
Compliant Sensor and Electronics Technology
Techniques for Integrating Sensors with Materials: Bulk and Surface Integration
INTERFACING TECHNOLOGIES
Electrical and Optical Connectivity
Bonding Techniques
Printing Techniques for Interfacing Structures
RELIABLE DATA PROCESSING PROVIDING ROBUSTNESS
AI Methods for Data Evaluation
Networking with Distributed Data Processing
Sensor Signal Processing: Sensor Data Fusion
RELIABLE COMMUNICATION PROVIDING ROBUSTNESS
Communication Protocols on Link and Application Layer: Hard- and Software Side
Communication on Physical Layer: Hardware Side, Physical Realization
ENERGY SUPPLY
Distribution, Management, Harvesting and Storage of Energy
Low-Power Electronics for Signal and Data Processing
APPLICATIONS
Smart Skin
Structural Health Monitoring
Body Area Networks
Smart Textiles
Casttronics
Metacomposites Programming