Materials for Electronic Packaging

Erscheinungsjahr 1995
ISBN: 978-0-7506-9314-1
Verlag: BUTTERWORTH HEINEMANN

Buch, Englisch, 368 Seiten, Format (B × H): 164 mm x 243 mm, Gewicht: 739 g

Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective.

The last few decades have seen tremendous progress in semiconductor technology, creating a need for effective electronic packaging. Materials for Electronic Packaging examines the interconnections, encapsulations, substrates, heat sinks and other components involved in the packaging of integrated circuit chips. These packaging schemes are crucial to the overall reliability and performance of electronic systems.

Zielgruppe

Professionals and advanced graduate students working in electronic materials and packaging.

Autoren/Hrsg.

Chung, Deborah D. L.

Fachgebiete

• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Drucktechnik und Reprografische Technik
• Wirtschaftswissenschaften Wirtschaftssektoren & Branchen Medien-, Informations und Kommunikationswirtschaft Druckindustrie, Verpackungsindustrie
• Technische Wissenschaften Verfahrenstechnik | Chemieingenieurwesen | Biotechnologie Verfahrenstechnik, Chemieingenieurwesen

Inhaltsverzeichnis

Overview of materials for electronic packagingSolderability fundamentals: role of microscopic processesDetermining the damaging strains which cause failure in lead tin soldersFluxless soldering for microelectronic applications, The effect of microstructure on the bonding of metal/ceramic interfacesThe future of advanced composite electronic packagingLow thermal expansion composite materials for electronic packagingElectrically conducting polymer-matrix compositesThick-film technologyElectroless copper for micropackaging and ultra large scale integrated circuit applicationsVacuum metallization for integrated circuit packagesElectrically conducting polymers and organic materialsDiamond filmsMeasurements of properties of materials in electronic packaging

Über Autor(innen)

Chung, Deborah D. L.
Professor Deborah D.L. Chung, Composite Materials Research Laboratory, University at Buffalo, State University of New York