Dummer / Mackenzie Robertson American Microelectronics Data Annual 1964-65

1. Auflage 2014
ISBN: 978-1-4831-8549-1
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 960 Seiten, Web PDF

American Microelectronics Data Annual 1964-65 provides comprehensive information on different microelectronics available in the U.S. The microelectronics covered in the text includes thin film, semiconductor, and integrated and hybrid circuit assemblies. The selection also provides an index that can be utilized for locating assemblies by the virtue of circuit function or design category. Information on the techniques essential in the practice of microelectronics is also included. The book will be of great use to student and professional electronics engineers and technicians.

Autoren/Hrsg.

Dummer, G. W. A.

Mackenzie Robertson, J.

Inhaltsverzeichnis

1;Front Cover;1
2;American Microelectronics Data Annual 1964-65;4
3;Copyright Page;5
4;Table of Contents;8
5;PREFACE;6
6;CHAPTER 1. AEROJET-GENERAL Microwelder Mark ll;21
7;CHAPTER 2. AEROTRONIC ASSOCIATES Model 470 Micro Logic Life/Aging System;27
8;CHAPTER 3.
ALPHA MICROELECTRONICS Custom Facilities;25
9;CHAPTER 4.
AMELCO Integrated Microcircuits;29
9.1;Type '.' buffer;30
9.2;Type 'C' counter-adapter;31
9.3;Type 'F' flip-flop;32
9.4;Type 'G' three input gate;33
9.5;Type 'H' half-adder;34
9.6;Type 'S' half-shift register;35
9.7;J11001 four input gate;36
9.8;G11001 five input gate;37
9.9;L11001 dual two input gate;38
9.10;M11001 dual three input gate;39
9.11;B12001 three input buffer amplifier;40
9.12;G12002/G12003 two, three and four input NAND/NOR;41
10;CHAPTER 5.
AUTONETICS Microelectronics;44
10.1;Two-dimensional approach;43
10.2;Integrated circuit approach;45
10.3;Hybrid approach;46
11;CHAPTER 6. BENDIX : The Bendix Semiconductor Division Approach to Monolithic Microcircuits. Program - Steps of Fabrication - Tentative specifications for active slices (amplifier and switching);47
12;CHAPTER 7.
BUNKER-RAMO Thin-Film Hybrid Microcircuits;58
13;CHAPTER 8. BURROUGHS : Thin Film Memory Planes. Introduction - Behavior of thin film memory elements - Thin film operating characteristics- Product information (thin film memory planes BIP-1000 and BIP-1001) - Applications information (noise-magnetic shielding - the transformer-diode matrix - current drivers - the information driver - the sense amplifier);59
14;CHAPTER 9. CENTRALAB 'PEC' Packaged Electronic Circuits;67
14.1;Properties of 'PEC' resistors;69
14.2;'PEC' packaged transistor amplifiers;72
14.3;Type YAD-006-01 four-stage amplifier;73
14.4;Type YAD-006-02 four-stage amplifier;73
14.5;Type YAD-006-03F6U four-stage amplifier;74
14.6;Type YAD-009-01F6U three-stage amplifier;75
14.7;Type YAD-013-01A6H four-stage amplifier;76
15;CHAPTER 10.
CONSOLIDATED REACTIVE METALS : Semiconductor alloy data;96
16;CHAPTER 11.
CTS Cermet Microminiature Modules;77
16.1;Thin film cermet capacitors;79
16.2;'Cerafer' series of resistor wafers, microelements and modules;80
16.3;'Ceradot' cermet pellet resistors;85
17;CHAPTER 12. FAIRCHILD: Characteristics and Applications of Micrologic Elements Introduction-Choice of circuit and characteristics of DCTL-Micrologic elements - Applications of Micrologic elements-Counters - Shift registers - Full adders - Code conversion-Two's and nine's complementers -Reclocking circuit-Some considerations on integrated circuit assembly techniques -Reliability considerations - Conclusions - References;87
17.1;Fairchild Planar Epitaxial Micrologic;97
17.2;Type 900 buffer;99
17.3;Type 901 counter adapter;100
17.4;Type 902 flip-flop;101
17.5;Type 903 three input gate;102
17.6;Type 907 four input gate;103
17.7;Type 914 dual two input gate;104
17.8;Type 904 half adder;105
17.9;Type 905 half shift register;106
17.10;Type 906 half shift register (without inverter);107
17.11;Type 915 dual three input gate;108
17.12;Type 916 JK flip-flop;118
17.13;Assured Customer Test Program;112
17.14;Graphic Symbols for Logic Diagrams (MIL Standard 806-B);116
17.15;Fairchild Planar Epitaxial Milliwatt Micrologic;124
17.16;Type 908 adder;128
17.17;Type 909 buffer;129
17.18;Type 910 dual gate;130
17.19;Type 911 gate;131
17.20;Type 912 half adder;132
17.21;Type 913 type D flip-flop;133
17.22;Type 921 gate expander;135
17.23;Assured Customer Test Program;136
18;CHAPTER 13. GENERAL INSTRUMENT: 'Multichip' technique. General description -Active device parameters - Resistors - Capacitors - Construction layout - Design procedure - Functional tests - Reliability test;141
18.1;CHAPTER 14.
G. I. Standard microcircuit packages;148
18.1.1;General Instrument Digital Microcircuits;160
18.1.2;Type NC-8/PC-8 flip-flop;161
18.1.3;Type NC-9/PC-9 steering gate;162
18.1.4;Type PC-13 RST flip-flop;163
18.1.5;Type NC-10 four input gate;164
18.1.6;Type PC-14 dual three input gate;152
18.1.7;Type PC-10 six input gate;154
18.1.8;Type NC-11 four input gate;155
18.1.9;Type PC-15 dual three input gate;157
18.1.10;Type PC-11 six input gate;158
18.1.11;Type NC-12/PC-12 buffer amplifier;158
18.1.12;Type NC/PC-101 video amplifier;10
19;CHAPTER 15. GENERAL MICRO-ELECTRONICS Integral Logic Circuits;165
19.1;Gate element (G);165
19.2;Dual gate element (D);165
19.3;Adder element (A);166
19.4;Exclusive OR element, half adder (H);166
19.5;Buffer element (B);166
19.6;Expander gate (E);166
19.7;Register element (R);166
19.8;Dual three input gate element D3;167
19.9;High power dual three input RTL gate;168
19.10;Dual four and eight input gates;169
19.11;Five input gate;170
19.12;GME tentative test specification for low power multi-logic;172
19.13;GME Integral Circuit Logic Tester, Model 6756;178
19.14;GME Integral Circuit Production Test Facility, Model 6301;179
20;CHAPTER 16. HAMILTON STANDARD Microminiature Electronics;183
20.1;Module 100 (flip-flop);184
20.2;Module 101 (NAND gate);185
20.3;Module 102 (NOR gate);186
20.4;Module 200 (flip-flop);186
20.5;Module 300 (servo amplifier);187
21;CHAPTER 17. HONEYWELL Integrated Circuits;189
21.1;Type MHM 1001/MHM 1101 Darlington amplifiers;189
21.2;Type MHM 2001/MHM 2201 Power Darlington amplifiers;189
21.3;Type MHM 4001 NOR/OR gate;189
21.4;Type MHM 4101 double gate;189
21.5;Type MHM 4201 adder;190
21.6;Type MHM 4301 half adder;190
21.7;Type MHM 4401 buffer;190
21.8;Type MHM 4501 register;190
21.9;Type MHM 3001 NAND gate;191
21.10;Type MHM 3101 AND/NOT gate;191
21.11;Type MHM 3201 set-reset-preset flip-flop;191
21.12;Type MHM 3301 dual-ranked system flip-flop;191
22;CHAPTER 18. HUGHES Integrated Circuits;193
22.1;XM 3001 (DM105) dual four input NAND gate;193
22.2;XM 3002 (DM104) eight input NAND gate;195
22.3;XM 4100 (DM101) differential amplifier;197
22.4;XM 4200 (DM102) operational amplifier;199
22.5;XM 4300 (DM103) preamplifier;201
23;CHAPTER 19. INTELLUX Microcircuit Logic Modules;203
23.1;Types ST1514B and ST1524B (Schmitt triggers);205
23.2;Type MV1050 (multivibrator);207
23.3;Types GB750 and GB1050 (NOR gate and buffer);209
23.4;Types GG750 and GG1050 (double NOR gates);211
23.5;Types FF750 and FF1050 (flip-flops);213
24;CHAPTER 20. IRC Hybrid Microcircuits : Advantages, Characteristics, Construction.Introduction - Advantages - Types of microcircuits - When to use a hybrid microcircuit - Design and construction ofhybrid microcircuits - Testing and quality control - Application engineering services;221
24.1;Type HL902 three stage audio amplifier;231
24.2;Type HD903 and HD905 NOR/NAND gates;233
25;CHAPTER 21. KEUFFEL AND ESSER "Cut 'n' Strip" Film for Microcircuit Masters;258
26;CHAPTER 22. KULICKE AND SOFFA Component Mounting Machine, Model 146;235
26.1;Integrated Circuit Assembly Machine, Model 410;237
26.2;Steady State Multi-Component Bonder, Model 607;241
26.3;Duplex Dice Mounter, Model 604;534
26.4;Probe-Marker Head, Model 341;946
27;CHAPTER 23. MALLORY Pellet Circuit Assembly Techniques : Introduction - Multiple pellet interconnections - X, Z, XY, XZ and XYZ packs;243
27.1;Examples of Mallory pellet component packaging;257
28;CHAPTER 24. MANN Continuous Process Photomask System : General - Economy -Security - Quality - Steps in preparation of masks;259
28.1;Type 1003 Reduction Camera;262
28.2;Type 992A Master Reticle Alignment Instrument;262
28.3;Type 1080 Photorepeater;262
29;CHAPTER 25. MELPAR Semiconductor Integrated Circuits;262
29.1;Type MM1001 single NAND gate;265
29.2;Type MM1003 RS flip-flop;266
29.3;Type MM1004 operational amplifier;267
30;CHAPTER 26. MOTOROLA 'MECL' Integrated Circuits;269
30.1;System Design with MECL Integrated Circuit Logic Blocks. Introduction - Logical and electrical characteristics of standard MECL units -MECL logic design considerations - Bias considerations for the MECL series - Applications;269
30.2;Motorola Integrated Circuits;289
30.3;Type MC201 and MC202 NAND/NOR gates;289
30.4;Type MC203 diode AND gate;291
30.5;Type MC204 power gate;293
30.6;Type MC205 line driver;295
30.7;Type MC206 dual NAND/NOR gate;297
30.8;Type MC209 flip-flop;299
30.9;Type MC301 five input logic gate;301
30.10;Type MC302 flip-flop (set-reset);305
30.11;Type MC303 half adder;309
30.12;Type MC304 bias driver;311
30.13;Type MC305 gate expander;313
30.14;Type MC306 and MC307 three input logic gates;315
30.15;Type MC309, MC310 and MC311 dual two input gates;319
30.16;Type MC1111 diode AND gate ( 3 - 4 );321
30.17;Type MC1112 diode AND gate ( 2 - 2 - 2 );323
30.18;Type MC1113 diode AND gate ( 1 - 1 - 1 - 2 );325
30.19;Type MC1114 eight-diode AND gate;327
30.20;Type MC1115 dual inverter;329
30.21;Type MC1116, MC1117 and MC1118 multi-diode gates;331
30.22;Type USN MEI diode AND gate ( 3 - 4 );333
30.23;Type USN ME2 diode AND gate ( 2 - 2 - 2 );337
30.24;Type USN ME3 diode AND gate ( 1 - 1 - 1 - 2 );341
30.25;Type USN ME4 eight diode AND gate;345
30.26;Type USN ME5 dual inverter;349
30.27;Type USN ME6 nine diode common P gate;353
30.28;Type USN ME7 nine diode common N gate;356
30.29;Type USN ME8 sixteen diode series/parallel matrix;359
30.30;Type MCI 110 emitter coupled amplifier;362
30.31;Tuned Amplifier Design with Motorola's MCI 110 Integrated Circuit Amplifier : Introduction - DC considerations - Characterization- Design of tuned amplifiers - Summary - References;368
31;CHAPTER 27. ( * MECL type );373
31.1;Type MC 1514 DC comparator;373
31.2;Type MC 1515 and MC 1516 high input impedance amplifiers;375
31.3;Type MC 1517 operational amplifier;378
31.4;Motorola 'Customline' Diode-Transistor Logic Integrated Circuits : General - Circuit availability - Reliability -Configurations and coding - Testing of completed circuits;379
32;CHAPTER 28. MYCALEX 'Supramica' Flat Packages for Integrated Circuits;368
33;CHAPTER 29. OPTIMIZED DEVICES Integrated Circuit Test System, Model 2500;391
34;CHAPTER 30. PHILCO Custom Hybrid Thin-Film Circuits;395
34.1;Micrologic and Milliwatt Micrologic;396
35;CHAPTER 31. RAYTHEON: Shift Registers Using Integrated NOR gates;397
35.1;Raytheon 'Planex' integrated circuits;402
36;CHAPTER 32. RCA: General Information on RCA Micromodules. Typical microelements-Micromodule construction and geometry- Advantages of micromodule construction - examples of construction- environmental tests;411
36.1;Basic micromodule laboratory kit;415
36.2;RCA Micromodules for Digital Computer Applications - General Data;421
36.3;Type DM-1437 monostable multivibrator;421
36.4;Type DM-1538 non-inverting power amplifier;422
36.5;Booklet assemblies for digital computer applications;424
37;CHAPTER 33. RCA Developmental type micromodules;427
37.1;Type DM0013A divider;427
37.2;Type DM0014A gate;429
37.3;Type DM0015A IF amplifier (4. 3 Mc);431
37.4;Type DM0016A IF limiter (4. 3 Mc);433
37.5;Type DM0017A discriminator (4. 3 Mc);435
37.6;Type DM0018A audio amplifier;437
37.7;Type DM0020A RF amplifier (49. 4 Mc);439
37.8;Type DM0021A mixer (4. 3 Mc);441
37.9;Type DM0022A sawtooth generator;443
37.10;Type DM0023B time modulator;445
37.11;Type DM0024A oscillator (192 Kc);447
37.12;Type DM0025A clipper;449
37.13;Type DM0026B pulse shaper;451
37.14;Type DM0027A output amplifier;453
37.15;Type DM0028B pulse generator;455
37.16;Type DM0030 converter;457
37.17;Type DM0031 IF amplifier (455 Kc);459
37.18;Type DM0032 IF amplifier (455 Kc);461
37.19;Type DM0033 detector;463
37.20;Type DM0034 audio amplifier;465
37.21;Type DM0035A audio amplifier;467
38;CHAPTER 33. SIGNETICS: Integrated Circuits - General Data;469
38.1;'VariFEB' customized integrated circuits;471
38.2;Signetics Integrated Circuits;472
38.3;Type SE101 and SE102 NAND/NOR gates;473
38.4;Type SE105 AND gate/diode array;477
38.5;Type SE110 NAND/NOR power gate;479
38.6;Type SE115 dual NAND/NOR, exclusive-OR gate;483
38.7;Type SE124 binary element;487
38.8;Type SE150 line driver;491
38.9;Type SE160 monostable multivibrator;495
38.10;Type CS700 and CS701 dual NAND/NOR gates;499
38.11;Type CS704 binary element;501
38.12;Type CS705 and CS709 dual diode array/AND gate;503
39;CHAPTER 34. SOLID STATE ELECTRONICS Series 2000 'Micromods';505
39.1;Model MML12001 logic inverter ( 1/2 flip-flop);507
39.2;Model MMSC2002 steering circuit (two circuits);507
39.3;Model MMA02003 AND/OR gates;507
39.4;Model MMCA2004 clock AND gate;507
39.5;Model MMA02005 AND/OR gates (two circuits);507
39.6;Model MMSG2006 supplementary gates;507
39.7;Model MM2007 emitter follower;507
40;CHAPTER 36. SPRAGUE Microelectronics : General - Semiconductor integrated circuits- thin-film integrated circuits - microminiature assemblies;513
40.1;Sprague thin-film 'Ceracircuit' microcircuits;517
40.2;Type UC-1500A general-purpose amplifier;517
40.3;A General-Purpose Ceramic-Base Thin-Film Microcircuit Amplifier. Introduction - Circuit description - Circuit performance-Applications - Typical characteristics - Construction- Conclusion;518
40.4;Type UC-1501A '84 DB' amplifier;523
40.5;Type UC-1502A '80 DB' phase splitter;425
40.6;Type UC-1503A '60 DB' amplifier;526
40.7;Type UC-1504A '58 DB' phase splitter;527
40.8;Type UC-1505A '40 DB' amplifier;528
40.9;Type UC-1506A '39 DB' phase splitter;529
40.10;Type UC-1507A '34 DB' amplifier;530
40.11;Type UC-1508A audio limiter;531
40.12;Type UC-1509A '22 DB' pulse distribution amplifier and limiter;532
40.13;Type UC-1510A 'unity gain' pulse distribution amplifier and limiter;533
41;CHAPTER 37. SYLVANIA Integrated Circuits;535
41.1;Reliability evaluation;540
41.2;Sylvania 'SUHL' logic circuits;540
42;CHAPTER 38. TEKTRONIX Digital Readout System, Type S-3101;607
43;CHAPTER 39. TEXAS INSTRUMENT Semiconductor Networks;615
43.1;Texas Instruments Series 51 Semiconductor Networks (Application Report: Introduction - Series 51 networks and logic design - Equipment design considerations - Typical applications- Breadboarding techniques;615
43.2;Series 51 Networks;641
43.3;Texas Instruments Series 52 Semiconductor Networks (Application Report, with network data included). Introduction -Circuit description - Gain setting and phase compensation techniques - Equipment design considerations - Typical applications;669
43.4;Series 53 Networks;721
43.5;Texas Instruments Minuteman type semiconductor networks;759
43.6;Texas Instruments Dynamically Controlled Welder, Model CPWA-296;807
43.7;Integrated Circuit Tester, Model 659A;809
43.8;Molecular Electronic PCM Telemetry Encoder;813
44;CHAPTER 40. VARO: Design Considerations for Thin-Film Microcircuits. Introduction- Conversion and design criteria - Actual circuit conversion - The Microbloc concept - Summary;817
44.1;Varo Thin-Film Microcircuits;826
45;CHAPTER 41. VECTOR Hybrid Thin-Film Integrated Circuits;841
46;CHAPTER 42. WELLS ELECTRONICS 'Weltek' Miniwelder, Model 500;847
47;CHAPTER 43. WESTINGHOUSE: Molecular Circuits, Applications and Design Considerations. Introduction - Equivalent Circuit parameters for functional blocks - Typical applications of functional electronic blocks - Molecular electronics interconnection techniques - Reliability - State of the art;849
47.1;Westinghouse Functional Electronic Blocks;895
48;CHAPTER 43. Westinghouse Flat-Pake for Functional Electronic Blocks. Introduction - Flat-Pak design considerations - Flat-Pakstructure - Flat-Pak manufacturing procedures - Functional Electronic Block encapsulation procedures - Environmental data - Package types;947
48.1;Flat-Pak package descriptions;959