Dummer Solid Circuits and Microminiaturization

Proceedings of the Conference Held at West Ham College of Technology, June, 1963.
1. Auflage 2014
ISBN: 978-1-4831-6485-4
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark

E-Book, Englisch, 356 Seiten, Web PDF

Solid Circuits and Microminiaturization is a collection of the proceedings of the Conference on Solid Circuits and Microminiaturization held at West Ham College of Technology in the UK in June 1963. The conference provided a forum for discussing trends in the microminiaturization of solid circuits and covered a wide range of topics related to the subject, including the design and manufacture of solid circuits; solid circuit fabrication techniques and the resulting passive component characteristics; and equipment design philosophy using integrated circuits. This book is comprised of 27 chapters and begins with an overview of the status and trends in microminiaturization, followed by a description of the techniques used to fabricate solid state circuits and a comparison of the properties of various types of solid state circuits. Subsequent chapters focus on the approaches used in the design and manufacture of solid circuits; characteristics and application of micrologic elements; techniques for the use of solid circuits together with conventional components in miniaturized assemblies; and the application of solid state circuits to computer design. High-speed integrated digital circuits and a group of integrated circuits for linear amplification are also described. This monograph will be of particular value to electronics engineers and systems designers.

Autoren/Hrsg.

Dummer, G. W. A.

Inhaltsverzeichnis

1;Front Cover;1
2;Solid Circuits and Microminiaturization;6
3;Copyright Page ;7
4;Table of Contents;8
5;LIST OF DELEGATES;12
6;CHAPTER 1. OPENING ADDRESS TO THE CONFERENCE.;26
7;CHAPTER 2. STATUS AND TRENDS IN MICROMINIATURIZATION;28
8;CHAPTER 3. SOLID STATE CIRCUIT TECHNOLOGY;34
9;CHAPTER 4. THE DESIGN AND MANUFACTURE OF SOLID CIRCUITS;48
10;CHAPTER 5. CURRENT DEVELOPMENTS IN MICROMINIATURIZATION AT SESCO-MCP;52
10.1;DISCUSSION;73
11;CHAPTER 6. THE SCOPE OF THE SOLID CIRCUIT CIRCUIT DESIGNER;78
12;CHAPTER 7. SOLID CIRCUIT FABRICATION TECHNIQUES AND THE RESULTING PASSIVE COMPONENT CHARACTERISTICS;86
13;CHAPTER 8. CHARACTERISTICS AND APPLICATIONS OF MICROLOGIC ELEMENTS;92
13.1;DISCUSSION.;113
14;CHAPTER 9. EQUIPMENT DESIGN PHILOSOPHY USING INTEGRATED CIRCUITS.;118
14.1;Reference;122
15;CHAPTER 10. TECHNIQUES FOR THE USE OF SOLID CIRCUITS TOGETHER WITH CONVENTIONAL COMPONENTS IN MINIATURISED ASSEMBLIES;124
16;CHAPTER 11.A TUNABLE SOLID-CIRCUIT FILTER FOR USE IN AN I.F. AMPLIFIER.;136
16.1;Reference;143
17;CHAPTER 12. A PUNCHED-TAPE COMPARATOR USING INTEGRATED CIRCUITS;144
18;CHAPTER 13. AN EQUIPMENT MAKER'S VIEWS ON SOME MICROMINIATURE SYSTEMS;154
18.1;DISCUSSION;170
19;CHAPTER 14. CHARACTERISTICS OF A SERIES OF COMPATIBLE DIGITAL LOGIC NETWORKS;178
20;CHAPTER 15. THE APPLICATION OF SOLID STATE CIRCUITS TO COMPUTER DESIGN.;186
21;CHAPTER 16. SOLID CIRCUIT LOGIC ELEMENTS USING MULTIPLE EMITTER TRANSISTORS;192
22;CHAPTER 17.HIGH SPEED INTEGRATED DIGITAL CIRCUITS;200
23;CHAPTER 18. A GROUP OF INTEGRATED CIRCUITS FOR LINEAR AMPLIFICATION;214
24;CHAPTER 19. A SOLID CIRCUIT AMPLIFIER;226
25;CHAPTER 20. INTEGRATED TUNNEL DIODE CIRCUITS;232
25.1;DISCUSSION;242
26;CHAPTER 21. DESIGN OF AN EXPERIMENTAL ELECTRON BEAM MACHINING APPARATUS;250
27;CHAPTER 22. ELECTRON BEAM ETCHING IN MICROMINIATURISATION;268
28;CHAPTER 23. PREPARATION OF SILICON DEVICE MATRICES FOR SOLID CIRCUITS;282
29;CHAPTER 24. CHARACTERISTICS AND APPLICATIONS OF SOLID CIRCUITS FROM SILICON DEVICE MATRICES;290
30;CHAPTER 25. THE ROLE OF THIN FILM CIRCUITS IN MICROMINIATURIZATION;296
31;CHAPTER 26. WHY MAKE CIRCUITS SOLID?;312
32;CHAPTER 27. A COMPARISON OF THE MICROELECTRONIC SYSTEMS;320
32.1;DISCUSSION;331
33;APPENDIX 1;346
34;INDEX - SUBJECTS;351
35;INDEX - AUTHORS AND DISCUSSION PARTICIPANTS;355