El-Kareh Silicon Devices and Process Integration
1. Auflage 2009
ISBN: 978-0-387-69010-0
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
Deep Submicron and Nano-Scale Technologies
E-Book, Englisch, 598 Seiten, Web PDF
Reihe: Engineering (R0)
ISBN: 978-0-387-69010-0
Verlag: Springer US
Format: PDF
Kopierschutz: 1 - PDF Watermark
This book includes discussion of silicon materials and electrical engineering properties as used in the design of analog components. Due to the author's background at Texas Instruments, the book will have an emphasis on newer process integration techniques and technology to help professional engineers in the field understand and develop electrical components.
Zielgruppe
Professional/practitioner
Autoren/Hrsg.
Weitere Infos & Material
Properties of the Silicon Crystal. Valence-bond and energy-band models. Thermal equilibrium statistics. Carrier transport mechanisms. Non-equilibrium conditions and carrier lifetime.- Junctions and Contacts. Ohmic, non-ohmic, and rectifying contacts. PN junctions, homo- and hetero-junctions. Contact und junction characterization, parameter extraction. Varactors.- Junction Field-Effect Transistor, JFET. Structure and mode of operation. Physics of JFET. JFET characterization and parameter extraction. High-voltage applications. Parasitic effects.- Bipolar Junction Transistor, BJT. Structure and mode of operation. Physics of BJT. Heterojunction Bipolar Transistor, HBT. Transistor characterization and parameter extraction. High-voltage applications.- Parasitic effects.
