Feng Design and Application of Intelligent Thermally Conductive Materials

1. Auflage 2025
ISBN: 978-0-443-40410-8
Verlag: Elsevier Science & Techn.
Format: EPUB
Kopierschutz: 6 - ePub Watermark

E-Book, Englisch, 900 Seiten

Design and Application of Intelligent Thermally Conductive Materials is a current, comprehensive, reference resource, providing information on the structure, design, and application of these newly developed materials in various contexts, together with an analysis of future trends and applications. The author presents a detailed description of the application of these intelligent materials to a wide range of uses, and also of their particular importance in the development and application of advanced chips. It provides postgraduates and senior undergraduates with an essential overview of thermal conductivity, from which to appreciate the descriptions of intelligent thermal conductivity.For all readers, including researchers, industry professionals, and technicians in the field, chapters on the structure, design, development and performance of intelligent thermal conductive materials provide essential information. While the potential future demand for these materials is enormous, the author indicates where developmental, technical, and production bottlenecks may occur. The possible use of intelligent thermal conductive materials in a wide range of contexts is discussed, together with their potential for energy saving and resource conservation. - Focuses on the newly evolving field of intelligent thermal conductive materials: a new type of functional materials designed for rapid heat diversion and management that enables autonomous response to the thermal environment using intelligent thermal conductivity control - Covers a broad range of topics relating to these newly-developed materials: from the structure of the basic materials to the design and application of intelligent materials - Discusses the application capacity for this type of intelligent or smart material - Provides updates on potential bottlenecks to the development, design, related technology, and production of these materials

Professor Wei Feng based at Tianjin University, China. He serves as a member of the 7th and 8th Academic Committee of Science and Technology Commission of the Ministry of Education, an executive director of the Chinese Society for Composite Materials, the first chairman of the Thermal Conductive Composites Committee of the Chinese Society for Composite Materials, and an executive director of the Polymer Materials and Engineering Branch of the Chinese Society for Materials Research. He is mainly engaged in the research of functional organic carbon composites and their applications, including high thermal conductivity materials, high-performance photothermal conversion and storage materials, structural fluorinated carbon materials, and bionic smart materials

Autoren/Hrsg.

Feng, Wei