Buch, Englisch, Format (B × H): 155 mm x 235 mm
Buch, Englisch, Format (B × H): 155 mm x 235 mm
ISBN: 978-0-387-30860-9
Verlag: Springer
The push toward lead-free components and in turn lead-free soldering in all computers, cell phones and other electronic devices has taken on a greater urgency as laws have been passed and are pending in the United States, the European Union and Asia which ban lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled and specifically affect process engineering, manufacturing and quality assurance.
This book offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture and implementation, which typically have been scattered in different sources. The book includes the some of the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.
Zielgruppe
Engineers, RFIC Designers, academic researchers and graduate students in electrical engineering.
Autoren/Hrsg.
Fachgebiete
- Technische Wissenschaften Elektronik | Nachrichtentechnik Nachrichten- und Kommunikationstechnik Funktechnik
- Technische Wissenschaften Sonstige Technologien | Angewandte Technik Angewandte Optik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Bauelemente, Schaltkreise
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikrowellentechnik
- Technische Wissenschaften Elektronik | Nachrichtentechnik Elektronik Mikroprozessoren
Weitere Infos & Material
Government/ Legislative activities.- Soldering fluxes for lead-free soldering.- Lead-free SMT Assembly.- Lead-free Wave Soldering.- Lead-free Rework.- Lead-free Board Surface Finishes.- Lead-free PCB Laminate Reliability.- Solder joint reliability.- Component Reliability.- Solder Alloy Properties.- Backward and Forward Compatibility. Lead-free standards.
