E-Book, Englisch, Band Volume 16, 367 Seiten, Web PDF
Reihe: Physics of Thin Films
Francombe Thin Films for Emerging Applications
1. Auflage 2013
ISBN: 978-1-4832-8891-8
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark
E-Book, Englisch, Band Volume 16, 367 Seiten, Web PDF
Reihe: Physics of Thin Films
ISBN: 978-1-4832-8891-8
Verlag: Elsevier Science & Techn.
Format: PDF
Kopierschutz: 1 - PDF Watermark
Following in the long-standing tradition of excellence established by this serial, this volume provides a focused look at contemporary applications. High Tc superconducting thin films are discussed in terms of ion beam and sputtering deposition, vacuum evaporation, laser ablation, MOCVD, and other deposition processes in addition to their ultimate applications. Detailed treatment is also given to permanent magnet thin films, lateral diffusion and electromigration in metallic thin films, and fracture and cracking phenomena in thin films adhering to high-elongation substrates.
Autoren/Hrsg.
Weitere Infos & Material
1;Front Cover;1
2;Thin Films for Emerging Applications;4
3;Copyright Page;5
4;Table of Cotents;6
5;Contributors;10
6;Preface;12
7;Chapter 1. High-Tc Superconducting Thin Films;14
7.1;I. Introduction;15
7.2;II. Sputtering and Ion-Beam Deposition;27
7.3;III. Vacuum Evaporation;52
7.4;IV. Laser Ablation;68
7.5;V. Metalorganic Chemical Vapor Deposition (MOCVD);94
7.6;VI. Metalorganic Deposition (MOD) and Other Processes;108
7.7;VII. Applications;114
8;Chapter 2. Permanent Magnet Thin Films: A Review of Film Synthesis and Properties;158
8.1;I. Introduction and Scope of Review;159
8.2;II. Properties of Permanent Magnet Films;167
8.3;III. Specific Permanent Magnet Film Systems;202
8.4;IV. Permanent Magnet Film Devices and Arrays;230
9;Chapter 3. Lateral Diffusion and Electromigration in Metallic Thin Films;246
9.1;I. Introduction;247
9.2;II. Formal Background;248
9.3;III. Techniques for Measurements;252
9.4;IV. Electromigration Studies;262
9.5;V. Interpretation of the Results;276
10;Chapter 4. Fracture and Cracking Phenomena in Thin Films Adhering to High-Elongation Substrates;284
10.1;I. Introduction;285
10.2;II. Background;288
10.3;III. Behavior of High-Elongation Materials;306
10.4;IV. On the Multiple Fracture of the Low-Elongation Component in Thin-Film Composites;324
10.5;V. Closure;346
10.6;Appendix;349
10.7;References;350
11;Index;354
12;Author Index;354
13;Subject Index;374
