Hall / Heck Advanced Signal Integrity for High-Speed Digital Designs

1. Auflage 2011
ISBN: 978-1-118-21068-0
Verlag: John Wiley & Sons
Format: EPUB
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, Band 1, 688 Seiten, E-Book

Reihe: Wiley - IEEE

A synergistic approach to signal integrity for high-speeddigital design
This book is designed to provide contemporary readers with anunderstanding of the emerging high-speed signal integrity issuesthat are creating roadblocks in digital design. Written by theforemost experts on the subject, it leverages concepts andtechniques from non-related fields such as applied physics andmicrowave engineering and applies them to high-speed digitaldesign--creating the optimal combination between theory andpractical applications.
Following an introduction to the importance of signal integrity,chapter coverage includes:
* Electromagnetic fundamentals for signal integrity
* Transmission line fundamentals
* Crosstalk
* Non-ideal conductor models, including surface roughness andfrequency-dependent inductance
* Frequency-dependent properties of dielectrics
* Differential signaling
* Mathematical requirements of physical channels
* S-parameters for digital engineers
* Non-ideal return paths and via resonance
* I/O circuits and models
* Equalization
* Modeling and budgeting of timing jitter and noise
* System analysis using response surface modeling
Each chapter includes many figures and numerous examples to helpreaders relate the concepts to everyday design and concludes withproblems for readers to test their understanding of the material.Advanced Signal Integrity for High-Speed Digital Designs issuitable as a textbook for graduate-level courses on signalintegrity, for programs taught in industry for professionalengineers, and as a reference for the high-speed digitaldesigner.

Autoren/Hrsg.

Hall, Stephen H.

Heck, Howard L.

Über Autor(innen)

STEPHEN H. HALL is a Senior Staff Engineer at IntelCorporation, where he leads a team focused on the research of newmodeling and measurement solutions for channel speeds as high as30Gb/sec. Previously at Intel, he was the lead designer for desktopand server buses on Pentium II, III, and IV based systems,coordinated research in the area of high-speed signaling withmultiple universities, led research and development teams in thearea of high-speed modeling, and taught signal integrity courses toengineers in two countries. He is also the author of High-SpeedDigital System Design (Wiley).
HOWARD L. HECK is a Principal Engineer at IntelCorporation, where he leads development of the signalingspecifications and solutions for USB 3.0. He also teacheshigh-speed digital interconnect design at the Oregon GraduateInstitute, is a Senior Member of the IEEE, and holds five patentsin the area of high-performance packaging and interconnects, withfive more pending.