Hong Computer Modelling of Heat and Fluid Flow in Materials Processing

1. Auflage 2010
ISBN: 978-1-4200-5701-0
Verlag: Taylor & Francis
Format: PDF
Kopierschutz: Adobe DRM (»Systemvoraussetzungen)

E-Book, Englisch, 272 Seiten

Reihe: Series in Material Science and Engineering

The understanding and control of transport phenomena in materials processing play an important role in the improvement of conventional processes and in the development of new techniques. Computer modeling of these phenomena can be used effectively for this purpose. Although there are several books in the literature covering the analysis of heat transfer and fluid flow, Computer Modelling of Heat and Fluid Flow in Materials Processing specifically addresses the understanding of these phenomena in materials processing situations.

Written at a level suitable for graduate students in materials science and engineering and subjects, this book is ideal for those wishing to learn how to approach computer modeling of transport phenomena and apply these techniques in materials processing. The text includes a number of relevant case studies and each chapter is supported by numerous examples of transport modeling programs.

Zielgruppe

Graduate students in material science and engineering and related subjects.

Autoren/Hrsg.

Hong, C.P.

Fachgebiete

• Naturwissenschaften Physik Thermodynamik Festkörperphysik, Kondensierte Materie
• Technische Wissenschaften Maschinenbau | Werkstoffkunde Technische Mechanik | Werkstoffkunde
• Naturwissenschaften Physik Physik Allgemein Theoretische Physik, Mathematische Physik, Computerphysik

Inhaltsverzeichnis

Mechanisms of Transport Phenomena

Governing Equations for Transport Phenomena

Similarities among the Three Types of Transport Phenomena

Basics of Finite Difference Methods

Steady State Heat Conduction

Transient Heat Conduction

Phase Change Problems

Convection and Diffusion Problems

Solution Algorithms for Fluid Flow

Fluid Flow Analysis Using the Simple Method